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© by SEMIKRON  /  2020-05-25  /  Technical Explanation  /  SKYPER

®

 12 PV 

PROMGT.1026/ Rev.7/ Template Technical Explanation

 

Page 1/37 

1.

 

Introduction ............................................................................................................................... 2

 

2.

 

Block Diagram and Application Example ........................................................................................ 3

 

2.1

 

Block diagram ....................................................................................................................... 3

 

2.2

 

Application example .............................................................................................................. 4

 

2.2.1

 

Primary side ................................................................................................................... 4

 

2.2.2

 

Secondary side ............................................................................................................... 5

 

3.

 

Dimensions and mechanical precautions ........................................................................................ 8

 

3.1

 

Dimensions .......................................................................................................................... 8

 

3.2

 

Plug-in connection ................................................................................................................. 8

 

3.3

 

Support post......................................................................................................................... 9

 

3.4

 

Solder connection .................................................................................................................. 9

 

3.5

 

Handling instructions ........................................................................................................... 10

 

4.

 

Interface Description................................................................................................................. 11

 

4.1

 

Footprint ............................................................................................................................ 11

 

4.2

 

Pin assignment ................................................................................................................... 11

 

4.2.1

 

Pin assignment of pin header X10 | Primary side ............................................................... 11

 

4.2.2

 

Pin assignment of pin header X100 | Secondary side | TOP ................................................ 12

 

4.2.3

 

Pin assignment of pin header X200 | Secondary side | BOT ................................................ 12

 

4.3

 

Power supply | Primary side ................................................................................................. 13

 

4.4

 

Gate drive signals | Primary side ........................................................................................... 14

 

4.5

 

Filter selection, jitter and propagation delay time | Primary side ............................................... 15

 

4.6

 

Error output | Primary side ................................................................................................... 15

 

4.7

 

Error input | Primary side ..................................................................................................... 16

 

4.8

 

Error mode selection | Primary side ....................................................................................... 17

 

4.9

 

External error input | Secondary side ..................................................................................... 17

 

4.10

 

Gate resistors | Secondary side ............................................................................................. 19

 

4.11

 

External boost capacitors | Secondary side ............................................................................. 20

 

5.

 

Protection features ................................................................................................................... 21

 

5.1

 

Failure management ............................................................................................................ 21

 

5.2

 

Dead time and Interlock ....................................................................................................... 24

 

5.3

 

Short pulse suppression (SPS) .............................................................................................. 25

 

5.4

 

Undervoltage lockout (UVLO) ................................................................................................ 25

 

5.5

 

Dynamic short circuit protection by V

CEsat

-monitoring (DSCP) .................................................... 26

 

5.5.1

 

DSCP | Functional description ......................................................................................... 27

 

5.5.2

 

DSCP | Calculation hints ................................................................................................ 28

 

5.6

 

Active clamping................................................................................................................... 29

 

5.7

 

Soft Off .............................................................................................................................. 30

 

5.8

 

Safe short circuit turn-off in multilevel topology ...................................................................... 31

 

6.

 

Electrical characteristic .............................................................................................................. 31

 

7.

 

Product Qualification ................................................................................................................. 32

 

8.

 

Environmental conditions .......................................................................................................... 33

 

9.

 

Marking ................................................................................................................................... 35

 

 
 

 

Technical Explanation 

SKYPER

®

  

12 PV 

Revision: 

03 

Issue date: 

2020-05-25 

Prepared by: 

Niklas Hofstötter 

Reviewed by: 

Daniel Obernöder 

Approved by: 

Marco Honsberg 

Keyword: IGBT driver core, L5070901 

Summary of Contents for SKYPER

Page 1: ...on jitter and propagation delay time Primary side 15 4 6 Error output Primary side 15 4 7 Error input Primary side 16 4 8 Error mode selection Primary side 17 4 9 External error input Secondary side 17 4 10 Gate resistors Secondary side 19 4 11 External boost capacitors Secondary side 20 5 Protection features 21 5 1 Failure management 21 5 2 Dead time and Interlock 24 5 3 Short pulse suppression S...

Page 2: ...th gate charges of up to 20µC reliably SEMIKRON s highly integrated ASIC technology allows using 30 fewer components than standard solutions which achieve a MTBF rate of 12 million hours at full load for the dual channel driver core in accordance with the industry standard SN29500 Figure 1 SKYPER 12 PV KEY FEATURES Two output channels 1 25W output power and 20A peak output current per channel Up t...

Page 3: ... Signal Processing Dead Time Generation Filter Management UVLO Error Management Gate Drive Management Power Supply Management Error Management Error Management Gate Drive Management UVLO DSCP DSCP UVLO nERR_IN_TOP nERR_IN_BOT PWR_VS_P_BOT PWR_GND_BOT PWR_VS_N_BOT PWR_VS_P_TOP PWR_GND_TOP PWR_VS_N_TOP BOT_ON BOT_OFF BOT_SOFTOFF CLMP_IN_BOT VCE_IN_BOT CFG_VCE_BOT TOP_ON TOP_OFF TOP_SOFTOFF CLMP_IN_T...

Page 4: ...y side Recommended values Component Value Remark CTOP_IN CBOT_IN 1nF Optional filter capacitors suppressing high frequency signals For further information please refer to 3 CBST Optional boost capacitor dimensioning according to chapter 4 11 RTOP_IN RBOT_IN 10kΩ Optional pull down resistors for steady off state of the corresponding output if no input signal is applied RnERR_OUT 4 75kΩ Optional pul...

Page 5: ... _TOP R GE_TOP C GE_TOP VCE_IN_BOT X200 02 BOT_ON X200 05 BOT_OFF X200 06 BOT_SOFTOFF X200 09 PWR_GND_BOT X200 08 RG on _BOT RG softoff _BOT RVCE_BOT DVCE_BOT D GE_BOT T2 RG off _BOT R GE_BOT C GE_BOT N PWR_VS_P_TOP X100 03 nERR_IN_TOP X100 04 CFG_VCE_TOP X100 01 CLMP_IN_TOP X100 07 PWR_GND_TOP X100 08 PWR_VS_N_TOP X100 10 C BST N _TOP R 2_CFG_TOP R 1_CFG_TOP C CFG_TOP C BST P _TOP PWR_VS_P_BOT X2...

Page 6: ...OP DVCE_BOT Optional high voltage diode for VCE monitoring mandatory if DSCP is used Dimensioning according to chapter 5 5 R1_CFG_TOP R1_CFG_BOT 10kΩ Optional resistors to adjust the trip level VCE ref of the dynamic short circuit protection necessary if DCSP is used Dimensioning according to chapter 5 5 R2_CFG_TOP R2_CFG_BOT Optional resistors to adjust the trip level VCE ref of the dynamic short...

Page 7: ...ration Disabled Disabled by connecting pin CFG_IDT to pin PWR_VS 5 2 Error mode In case of any secondary side error condition the event will be reported at the pin nERR_OUT The driver turns off the affected output immediately and the second output with the next turn off signal at the corresponding input Both outputs remain blocked until the error state is reset Selected by connecting pin CFG_ERR t...

Page 8: ...primary side and the two secondary side plug in connectors are 10 pin dual row 2 54mm pin headers For a secure mechanical connection of the SKYPER 12 PV IGBT driver it is essential that the pin headers can be fully supported by the female mating connectors Example for a suitable female mating connector Description Shape Manufacturer Art no female RM2 54 10p SMD 2ROW Suyin 254100FA Using SMD type m...

Page 9: ...ssification at least Example of a support post Description Shape Manufacturer Art no Nylon support post Dual lock Essentra DLMSPM 8 01 12mm Figure 6 SKYPER 12 PV Support post mounting hole for support post principle of a supported driver on an adapter board 3 4 Solder connection The SKYPER 12 PV driver core can be soldered directly onto an adapter or control board It should be noted that if the dr...

Page 10: ... original packaging just before mounting When mounting the driver it has to be ensured that the work is done in an ESD protected workplace environment Persons working with the driver have to wear ESD wristbands overalls and shoes If tools are used for mounting those must comply with ESD standards When handling the driver do not pick up the driver at the transformers The driver MUST be handled at t...

Page 11: ... 150kΩ pull up LOW 2µs interlock dead time HIGH No interlock dead time X10 03 nERR_OUT Error output Open collector output max 18V 15mA external pull up resistor needed LOW Error HIGH No error X10 04 nERR_IN Error input 15V logic inverted 150kΩ 10nF pull up LOW External error HIGH No external error X10 05 CFG_ERR Error behaviour configuration in case of any error condition 15V logic 150kΩ pull down...

Page 12: ...f Iout avg Iout peak VG off X100 07 CLMP_IN_TOP VCE clamping input 150kΩ 0 01nF pull down In case of activated TOP_OFF LOW TOP_OFF equal to VG off HIGH TOP_OFF floating X100 08 PWR_GND_TOP Ground potential of power supply and digital signals Reference potential of gate voltages emitter source of power semiconductor X100 09 TOP_SOFTOFF SoftOff signal terminal for TOP semiconductor External gate res...

Page 13: ...istor needed X200 10 PWR_VS_N_BOT Power supply output negative voltage Equal to VG off external buffer capacitors can be optionally connected 4 3 Power supply Primary side For a proper operation of the SKYPER 12 PV driver core a power supply of at least 15W 1A shall be connected to the driver s power supply pins During power up of the driver turn on signals should not be applied to the driver s in...

Page 14: ...s Further information to the short pulse suppression are referred in chapter 5 3 Figure 10 SKYPER 12 PV Primary side Gate drive signals When using the driver in environments with high levels of electromagnetic noise it is recommended to connect a filter capacitor CTOP_IN CBOT_IN of several hundred pico Farads as close as possible to the signal inputs Please note that these capacitors affect the pr...

Page 15: ...erator of the driver of typically 2µs A detailed description of the interlock function and the dead time generation is referred in chapter 5 2 CFG_FLT CFG_IDT Setting Filter time Delay time Jitter HIGH HIGH LOW Digital filter 390ns 830ns 12 5ns LOW LOW Analogue filter 200ns 500ns 3ns 12 5ns LOW HIGH Analogue filter 200ns 500ns 3ns 4 6 Error output Primary side The SKYPER 12 PV reports any detected...

Page 16: ...her forming a common bi directional HALT line Additionally all CFG_ERR configuration pins have to be connected to ground potential as shown in Figure 12 In this configuration any driver connected to the HALT line can force the outputs of all connected drivers to off state and locks them when the driver pulls its nERR_OUT output to low level If a specific turn off sequence is required as it is comm...

Page 17: ...standard turn off or the soft off path as described above Further information related to the primary and secondary side error events as well as on the error reset conditions is referred in chapter 5 1 4 9 External error input Secondary side Each secondary side of the driver provides an error input nERR_IN_TOP nERR_IN_BOT to handle external error events These inputs are low active Pulling one input...

Page 18: ...ommended values Component Value Remark C1 1nF C2 100nF C3 1µF R1 30 1kΩ R2 15kΩ R3 30 1kΩ R4 30 1kΩ RCFG temp The value of the resistor RCFG temp has to be determined considering the resistance characteristic of the connected thermistor and the desired trip level Parameter Min Typ Max Threshold high 13 V Threshold low 2 V ...

Page 19: ...r semiconductor in accordance with the individual application parameters e g IGBT technology diode switching frequency losses application layout inductivity stray inductance DC link voltage and driver capability The complete design of an application must be viewed as a whole with due considering of the above mentioned parameters at least Interacting and interfering effects within the whole applica...

Page 20: ...r each output channel is recommended if the connected gate charge is larger than 2 5µC For maximum effectiveness these capacitors have to be placed as close as possible to the corresponding terminal as shown in Figure 15 Figure 15 SKYPER 12 PV Secondary side Boost capacitors The required capacitance of the optional external boost capacitors can be estimated by the following equation 𝐶𝐵𝑆𝑇 𝑃 𝐶𝐵𝑆𝑇 𝑁 ...

Page 21: ...dard LOW LOW immediately OFF and locked immediately until reset Standard Undervoltage of power supply secondary side HIGH LOW immediately OFF affected channel immediately 2nd channel with next turn off signal at the corresponding input Locked immediately OFF locked until reset Soft Off affected channel Standard not affected channel LOW LOW immediately OFF and locked immediately until reset Short c...

Page 22: ...turns ready for operation by setting the nERR_OUT output to high level If the driver has entered error state because of an externally reported error event by the controller via the driver s primary side nERR_IN pin the driver can be reset under the following conditions 30µs has elapsed until the external error event occurred 9µs no input signals at TOP_IN BOT_IN Important note In this particular c...

Page 23: ...ation pin CFG_ERR is connected to PWR_VS Figure 16 SKYPER 12 PV Behavior on error event t 30µs 9µs VIH VIL TOP_IN X10 07 BOT_IN X10 08 VIH VIL nERR_OUT X10 03 TOP_ON OFF X100 06 071 BOT_ON OFF X200 06 071 no error error VG on VG off VG on VG off t t t t t t Error event 30µs nERR_IN X10 04 no error error 9µs no error error 1 The signal characteristics of BOT_ON OFF and TOP_ON OFF are valid if the o...

Page 24: ...ong as the dead time of 2µs has not elapsed the driver locks the second output If the pulse pattern generated by the customer s controller also includes a dead time the resulting system dead time will be determined by either the controller or the driver depending on whichever dead time duration is longer The SKYPER 12 PV does not add the internal generated dead time to the dead time of the pulse p...

Page 25: ...s below the shutdown threshold levels the driver enters into error state The same applies when a negative gate voltage exceeds the shutdown threshold level Once entered into error state the driver executes its error routine as described in chapter 5 1 The error condition resets when the supply voltage and both positive gate voltages have exceeded the non error threshold level and both negative gat...

Page 26: ...feature is designed to detect short circuit conditions and forces the driver to react on the desaturation event of a semiconductor It is explicitly stated that this function is designed to detect short circuit conditions and not to set a specific threshold to detect overcurrent situations e g of externally connected applications SEMIKRON recommends to set the DSCP trip level to a value of 7V to 9V...

Page 27: ... semiconductor has reached its static level VCE ref VCE stat Simultaneously to the discharging process of the capacitor CCFG the semiconductor starts conducting and reducing the collector emitter voltage VCE to VCEsat When the Collector Emitter voltage of the IGBT falls below 10V the high voltage diode DVCE is starting to operate in forward direction Now the voltage VCE IN at the VCE_IN pin follow...

Page 28: ...or a certain value of 𝑉𝐶𝐸 𝑠𝑡𝑎𝑡 𝑅2_𝐶𝐹𝐺 𝑅1_𝐶𝐹𝐺 𝑉𝐶𝐸 𝑠𝑡𝑎𝑡 𝑃𝑊𝑅_𝑉𝑆_𝑃 𝑉𝐶𝐸 𝑠𝑡𝑎𝑡 Equation 3 Calculation of the blanking time 𝑡𝑏𝑙 𝑉𝐶𝐸 depending on the values of 𝐶𝐶𝐹𝐺 𝑅1_𝐶𝐹𝐺 𝑅2_𝐶𝐹𝐺 𝑉𝐶𝐸 𝑠𝑡𝑎𝑡 𝑡𝑏𝑙 𝑉𝐶𝐸 𝐶𝐶𝐹𝐺 𝑅1_𝐶𝐹𝐺 𝑅2_𝐶𝐹𝐺 𝑅1_𝐶𝐹𝐺 𝑅2_𝐶𝐹𝐺 ln 10𝑉 𝑃𝑊𝑅_𝑉𝑆_𝑃 𝑅1_𝐶𝐹𝐺 𝑅2_𝐶𝐹𝐺 𝑅2_𝐶𝐹𝐺 𝑅1_𝐶𝐹𝐺 Equation 4 Calculation of the voltage 𝑉𝐶𝐸 𝐼𝑁 at the VCE_IN input depending on the values of 𝑉𝐶𝐸 𝑅𝑉𝐶𝐸 𝑉𝐷_𝑉𝐶𝐸 𝑉𝐶𝐸 𝐼𝑁 𝑅1 𝑅2 𝑅1 𝑅2 𝑅1 𝑅2 𝑅𝑉𝐶...

Page 29: ...will get conductive This leads to a current feeding energy into the gate of the IGBT and gradually switches the IGBT on again until the VCG voltage is reduced below the VZener reference The CLMP_IN input indicates the driver that the collector gate voltage raised above Vzener if the voltage at the input exceeds the threshold of 13V When entering active clamping mode the driver sets the output chan...

Page 30: ...vides a separate turn off path TOP_SOFTOFF BOT_SOFTOFF activated by the driver if an error event is detected on the secondary side as described in chapter 5 1 Switching off a semiconductor via the soft off path aims to reduce the switching speed of the semiconductor and hence the over voltage caused by the di dt through the system s stray inductances is decreased Recommendation Usually the Soft Of...

Page 31: ... clamping features ensure that the SKYPER 12 PV allows proper control of the power semiconductors in multilevel applications And thanks to the advanced error management provisions realized in the ASIC chipset the SKYPER 12 PV safely handles even short circuit conditions Detailed information how to use the SKYPER 12 PV driver core in multilevel applications are referred in the Application Note AN19...

Page 32: ...0 4 29 ISO Isolation 5 0 kV AC rms 60s IEC 62109 TC Thermal Cycling 500 cycles a 1h 40 C 85 C IEC 60068 2 14 TH Temperature Humidity 85 C 85 RH 1000h passive and at high voltage IEC 60068 2 67 BST Burst Power terminals 4kV Control terminals 2kV IEC 61000 4 4 CC Climate Change 15 C to 85 C 10 to 85 10 cycles a 8h IEC 60068 2 30 ESD ESD Contact discharge 6kV Air discharge 8kV IEC 61000 4 2 RFF Radio...

Page 33: ...s series test 5000 V AC rms 60s IEC 61800 5 1 Rated insulation voltage 8 kV Cat III IEC 60664 1 Partial discharge 2 2kV 1 8kV IEC 61800 5 1 Creepage distance primary to secondary side 20 9mm IEC 61800 5 1 Clearance distance primary to secondary side 14 0mm IEC 61800 5 1 Creepage distance secondary to secondary sides 10 5mm IEC 61800 5 1 Clearance distance secondary to secondary 6 1mm IEC 61800 5 1...

Page 34: ... IEC 61800 3 Immunity against external interference 30V m 80MHz 1000 MHz IEC 61000 4 3 IEC 61800 3 Immunity against conducted interference 20V 150kHz 80MHz IEC 61000 4 6 IEC 61800 3 Shock Vibration Rating Norm Standard Vibration Sinusoidal 20Hz 500Hz 5g 26 sweeps per axis x y z Random 10Hz 2000Hz 3g 2 h per axis x y z IEC 60068 2 6 Shock 6000 Shocks 6 axis x y z 1000 shocks per axis 30g 18ms The c...

Page 35: ...echnical Explanation SKYPER 12 PV PROMGT 1026 Rev 7 Template Technical Explanation Page 35 37 9 Marking Figure 23 SKYPER 12 PV Label Every driver core is marked with a data matrix label The marking contains the following items ...

Page 36: ... 12 PV Dynamic short circuit protection 28 Figure 20 SKYPER 12 PV Active clamping 29 Figure 21 SKYPER 12 PV Application example for active clamping 29 Figure 22 SKYPER 12 PV Maximum switching frequency 31 Figure 23 SKYPER 12 PV Label 35 Table 1 SKYPER 12 PV Application example Primary side Recommended values 4 Table 2 SKYPER 12 PV Application example Secondary side Recommended values 6 Table 3 SKY...

Page 37: ...N in a written document signed by authorized representatives of SEMIKRON SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury No representation or warranty is given and no liability is assumed with respect to the accuracy completeness and or use of any information herein i...

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