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MF877-00                                                                                                Page  1 
Template Revision C, 30-July-2018 

 

Copyright 2018 Hewlett Packard Enterprise Development LP

 

HPE instructions for this template are available a

MF877-01

  

 

Product End-of-Life Disassembly Instructions 

Product Category

Servers

 

 

Marketing Name / Model 

 

[List multiple models if applicable.] 

HPE ProLiant DL380 Gen9 

Name / Model #2  

Name / Model #3  

Name / Model #4   

Name / Model #5  

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by 
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment 
(WEEE). 

1.0

 

Items Requiring Selective Treatment

 

 1.1 Items listed below are classified as requiring selective treatment. 
 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as   
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
           

Batteries 

All types including standard alkaline and lithium 
coin or button style batteries              

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface 
greater than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

Depending on Power Supply Model 

External electrical cables and cords 

            

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above) 

            

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Summary of Contents for ProLiant DL380 Gen9

Page 1: ...n the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 8 Batteries All types including standard alkaline and lithium coin or button style batteries 2 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 ...

Page 2: ...kwise 180 degrees until the thumbscrews pop up and disengage from the system board 7 Lift up evenly on the PCI riser cage to unseat the PCI riser boards from the system board and remove the PCI riser cage from the server chassis 8 Remove all expansion boards if installed 9 Loosen the two hex screws that secure the serial port cable to the rear bracket to disconnect the serial port cable 10 Disconn...

Page 3: ...it stops 27 Carefully lift the system board out of the chassis 28 Capacitors 2 5CM Remove the power supply s from the system With 2 Philips screw driver remove the screws securing the top cover and the heatsinks in the P S then locate the capacitors and pry from the PCB with a medium flat head screw driver and dispose of properly 3 2 Optional Graphic If the disassembly process is complex insert a ...

Page 4: ...MF877 00 Page 4 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 5: ...MF877 00 Page 5 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 6: ...MF877 00 Page 6 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 7: ...MF877 00 Page 7 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 8: ...MF877 00 Page 8 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

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