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EL-MF877-00                                                Page 1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: Personal Computers

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP Z2 SFF G5 Workstation 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contac

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 “x” 

inside the

 “[ ]”): 

[          ] screws 
[

X

] snaps 

[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

           

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

           

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

Acbel 260W EPA92 PSU 

External electrical cables and cords 

 Power  Cord 

Gas Discharge Lamps 

            

           

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above)  

 

           

           

Summary of Contents for Z2 SFF G5

Page 1: ...plicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 2 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 1 Li Ion batteries Include all Li Ion batteries if more than one is provided with the product such as a detachable notebook ...

Page 2: ...nd materials requiring selective treatment including the required steps to remove the external enclosure 1 Open access panel 2 Remove Front Bezel from chassis 3 Press the Graphic card s latch 4 Unplug Graphic card 5 Loose the screws of HDD and remove HDD from HDD cage 6 Disconnect HDD power cable and HDD SATA cable from HDD 7 Disconnect all cables from MB 8 Remove the driver cage from Chassis 9 Di...

Page 3: ...ectrolytic Capacitors of greater than 2 5cm in diameter or height and Remove it 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations Step1 Open access panel Step2 Remove front bezel from chassis Step 3 Press the Graphic card s ...

Page 4: ...7 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step7 Disconnect all cables from MB Step8 Remove the driver cage from Chassis ...

Page 5: ...May 2018 HPI instructions for this template are available at EL MF877 01 Step 9 Disconnect system fan cable from MB Step 10 Disconnect cooler fan cable from MB Step 11 Remove the Fan duct from cooler Step 12 Use T 15 screwdriver to loose the screws and remove cooler ...

Page 6: ...n date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step 13 Use PH1 screwdriver to loose the screws and remove the fan Step 14 Separate the fan from cooler Step 15 Remove memory from MB Step 16 Rotate the handle and open it up ...

Page 7: ...revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step 17 Remove the CPU from the board Step 18 Remove the battery from the system board Step 19 Remove speaker from Chassis Step 20 Remove WLAN M 2 Card ...

Page 8: ...8 HPI instructions for this template are available at EL MF877 01 Step 21 Use T 15 screwdriver remove the screws on the PSU Chassis Step 22 Disconnect the PSU cable from the MB Step 23 Use T 15 screwdriver to loose the screws of MB from board Step 24 Remove MB from chassis ...

Page 9: ...evalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step 25 Press the PSU s latch on chassis Step 26 Remove the PSU from chassis Step 27 Use PH1 screwdriver to remove screw for the PSU Step 28 Remove cover ...

Page 10: ...L MF877 01 Step 29 Use PH1 screwdriver to remove FG screw Step 30 Disconnect fan connector and inlet connector Step 31 Use PH1 screw driver to remove PCB1 screw Step 32 Use PH1 screwdriver to remove AC inlet Fan screw Step 33 Heat the solder of the Electrolytic Capacitors of greater than 2 5cm in diameter or height and Remove it ...

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