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MF877-00                                                Page 1 
Template Revision C, 30-July-2018 

 

Copyright 2018 Hewlett Packard Enterprise Development LP

 

HPE instructions for this template are available at 

MF877-01

  

 

Product End-of-Life Disassembly Instructions 

Product Category

Servers

 

 

Marketing Name / Model 

 

[List multiple models if applicable.] 

HPE ProLiant DL380 Gen10 Plus 

 

 

 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by 
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment 
(WEEE). 

1.0

 

Items Requiring Selective Treatment

 

 1.1 Items listed below are classified as requiring selective treatment. 
 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as   
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
           

Batteries 

All types including standard alkaline and lithium 
coin or button style batteries              

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface 
greater than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

            

14 

External electrical cables and cords 

            

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above) 

            

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Summary of Contents for ProLiant DL380 Gen10 Plus

Page 1: ...ght column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 8 Batteries All types including standard alkaline and lithium coin or button style batteries 2 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 Liquid C...

Page 2: ...TNS BB05 from the system 5 Use Torx driver with T15 to unlock screws and remove bracket with PCA from LFF system remove HDD cage with PCA from SFF system 6 Remove the Power supply s from system 7 Use Torx driver with T15 to unlock thumbscrew and remove the System board with tray from system 8 Riser cage Use Torx driver with T15 to unlock screws and Remove the riser card PCA 9 bracket with PCA Use ...

Page 3: ...pyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 1 Remove top cover of systems by hood latch 2 Remove Fan cage module Air baffle and Riser cage from system 1 Remove top cover of systems ...

Page 4: ...y 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 Remove lithium battery from the system by medium flat head screw driver 4 Remove Mega cell HSTNS BB05 from the system ...

Page 5: ...ett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 5_a Use Torx driver with T15 to unlock screws 5_b Remove bracket with PCA from LFF system Remove HDD cage with PCA from SFF system 6 Remove the power supply s from system ...

Page 6: ...n C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 7_a Use Torx driver with T15 to unlock thumbscrew 7_b Remove the system board with tray from system ...

Page 7: ...18 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 8_a Use Torx driver with T15 to unlock screws 8_b Remove the riser card PCA 2 Remove Fan cage module and Riser cage from system ...

Page 8: ...opyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 9_a Use Torx driver with T15 to unlock screws 9_b Remove HDD BP PCA from bracket LFF system Remove HDD BP PCA from HDD cage SFF system ...

Page 9: ...pyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 10_a Use Torx driver with T15 5 mm socket screwdriver and 8 mm socket screwdriver to unlock screws 10_b Remove System board PCA from tray ...

Page 10: ... instructions for this template are available at MF877 01 10_a Use Torx driver with T15 5 mm socket screwdriver and 8 mm socket screwdriver to unlock screws 10_b Remove System board PCA from tray Remove Electrolytic Capacitors C801 25mm 55mm and C237 C238 C241 10mm 25mm from power supply HSTNS PD40 HSTNS PD40 1 ...

Page 11: ...rd Enterprise Development LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor C102 25mm 25mm from HSTNS PL40 HSTNS PL40 1 Remove Electrolytic Capacitor BC1 25mm 60 mm and C106 C107 C108 10mm 25mm from power supply HSTNS PC40 HSTNS PC40 1 ...

Page 12: ...terprise Development LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor C801 25mm 60mm and C237 C238 C241 10mm 25 from power supply HSTNS PD41 HSTNS PD41 1 Remove Electrolytic Capacitor C102 30mm 30mm from power supply HSTNS PL41 HSTNS PL41 1 ...

Page 13: ...ment LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor BC1 25mm 60 mm and C106 C107 C108 10mm 25mm from power supply HSTNS PC41 HSTNS PC41 1 Remove Electrolytic Capacitor C801 25mm 60mm and C212 C233 C238 10mm 25mm from power supply HSTNS PD44 HSTNS PD44 1 ...

Page 14: ...ackard Enterprise Development LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor C102 30mm 30mm from power supply HSTNS PL45 HSTNS PL45 1 Remove Electrolytic Capacitor C101 C105 C106 C114 C115 8mm 20mm from power supply HSTNS PL46 1 ...

Page 15: ...t Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor from power supply HSTNS PF46 1 Remove Electrolytic Capacitors C201 202 10mm 38 5mm C200 26mm 43mm C250 251 13mm 50mm from power supply HSTNS PR62 ...

Page 16: ...Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 Remove Electrolytic Capacitor C102 30mm 30mm from power supply HSTNS PL62 Remove Electrolytic Capacitor C12 1 60mm 25mm C328 18mm 30mm from power supply HSTNS PD70 ...

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