background image

EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: Monitors and Displays

 

Marketing Name / Model 
[List multiple models if applicable.] 

OMEN X 25f 
HSD-0021-Q

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contact 

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 

I/F Board*1, Ctrl Board*1, Ctrl Lens Board*1, LED 
Board*1, LED Driver Board*1, G-sync2 Board*1

 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”):

 

[          ] screws 
[          ] snaps 
[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps   panel*1 

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Содержание OMEN X 25f

Страница 1: ...ntity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm I F Board 1 Ctrl Board 1 Ctrl Lens Board 1 LED Board 1 LED Driver Board 1 G sync2 Board 1 6 Batteries excluding Li Ion batteries ...

Страница 2: ...s that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Screw driver 1 Hexagon Screw Driver 0 Flathead screwdriver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatme...

Страница 3: ...m the bracket 11 Remove the battery which is on the interface board 12 Remove the gasket thermal pad and tape on the chassis 13 Use tool to release screws and separate base 14 Use tool to release screws and separate base cover 15 Use tool to release screws and separate VESA from stand 16 Use tool to release screws and separate the back cover from stand 17 Use tool to release screws and separate hi...

Страница 4: ...ion date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 Use tool to separate rear cover from monitor head through tear down slot 4 Use tool to release screw bezel trin then separate bezel trin plastic lens and bezle trin SHD ...

Страница 5: ...EL MF877 00 Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 5 Separate rear cover by hand ...

Страница 6: ...on C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 6 Separate ctrl FFC stand LED FFC 7 Use tool to release screw then separate ctrl PCB stand LED PCB and power LED PCB from rear cover ...

Страница 7: ...EL MF877 00 Page 7 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 8 Separate internal and release tape 3 power wire and LVDC FFC ...

Страница 8: ... HPI instructions for this template are available at EL MF877 01 9 Use tool to release screw then separate middle frame 10 Use tool to release screw then separate interface PCB and LED driver PCB 11 Remove the screws form column and separate plastic part 12 Remove cable clip ...

Страница 9: ...EL MF877 00 Page 9 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Страница 10: ...vision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 13 Remove the screw from hook and remove hook 14 Remove the screw from BKT and remove life module and disassemble lift module ...

Страница 11: ...EL MF877 00 Page 11 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 15 Remove the rubber from base ...

Отзывы: