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EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 19-March-2021 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: Monitors and DisplaysExternal Options

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP M27fwa FHD  Monitor 
HP M27fwa FHD Monitor-NA 
HP M27fwa 
HSD-0104-K 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for 

the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on 
the plastic part. For any questions on plastic marking, please contac

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 

Display Board*1, Main Board*1

 

2

 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button 
style batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more 
than one is provided with the product (such as a 
detachable notebook keyboard battery, RTC coin cell, 
etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”):

 

[          ] screws 
[          ] snaps 
[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface greater 
than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  panel*1 

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

 C605 in SPS board 

External electrical cables and cords 

 HDMI cable*1, VGA cable*1, Power cord*1, 

4

 

Summary of Contents for M27fwa

Page 1: ...in the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm Display Board 1 Main Board 1 2 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 0 Li Ion batteries In...

Page 2: ...Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Screwdriver 2 Slothead screwdriver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials re...

Page 3: ...ocess is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations 1 Lay the display on soft desk and push the button of stand to unlock the stand then pull out the stand form the monitor head 2 Twist out the screw and separate base and stand Push up the whlte button ...

Page 4: ...le at EL MF877 01 3 Strip two screws from the rear cover then move rear cover follow the below way 4 Strip four screws from the hinge Twist out the screw Remove the screws with Screwdriver Dismantle the rear cover first from the two marked position Remove the 8pin FFC from main board then remove rear cover Remove the DECO ...

Page 5: ...evalidation date 19 March 2021 HPI instructions for this template are available at EL MF877 01 5 Remove the acetate tapes from the LVDS LED cable 6 Pull out the LVDS LED cable to panel 7 Strip fourteen screws from the rear cover supporter and M B ...

Page 6: ...EL MF877 00 Page 6 Template Revision C Last revalidation date 19 March 2021 HPI instructions for this template are available at EL MF877 01 ...

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