Four-Faith F-B200GLGL Hardware Design Manual Download

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F-B200GLGL

NB-IoT

module hardware design
manual

Document Version

Security

V1.0.3

F-B200GLGL

35 pages

F-B200GL NB-IoT Module

Hardware Design Manual

Xiamen Four-Faith Communication Technology Co., Ltd.

Add:

Floor

11,

Area

A06,

370,chengyi

street,Jimei,Xiamen
Tel: +86 592-5907276

Fax: +86 592-5912735

Web: http://en.four-faith.com

Summary of Contents for F-B200GLGL

Page 1: ...ersion Security V1 0 3 F B200GLGL 35 pages F B200GL NB IoT Module Hardware Design Manual Xiamen Four Faith Communication Technology Co Ltd Add Floor 11 Area A06 No 370 chengyi street Jimei Xiamen Tel 86 592 5907276 Fax 86 592 5912735 Web http en four faith com ...

Page 2: ... design manual 2 34 Add Floor 11 Area A06 No 370 chengyi street Jimei Xiamen China http en four faith com Tel 86 592 5907276 Fax 86 592 5912735 Files Revised Record Date Version Remark Author 2019 7 2 V1 0 3 Initial version Jim Chen ...

Page 3: ...n permission all commercial use of the files from Four Faith are forbidden such as copy distribute reproduce the files etc but non commercial purpose download or printed by individual all files shall be not revised and the copyright and other proprietorship notice shall be reserved are welcome Trademark Notice Four Faith 四信 are all registered trademarks of Xiamen Four Faith Communication Technolo...

Page 4: ... B200GL NB IoT module hardware design manual 4 34 Add Floor 11 Area A06 No 370 chengyi street Jimei Xiamen China http en four faith com Tel 86 592 5907276 Fax 86 592 5912735 Product Appearance TOP BOTTOM ...

Page 5: ... 6 1 Power Supply Interface 16 2 6 2 Power Supply Reference Design 16 2 7 Module Startup Shutdown 17 2 7 1 Startup 17 2 7 2 Shutdown 18 2 8 Module Reset 18 2 9 U SIM interface 19 2 10 UART interface 21 2 11 I2C Interface 23 2 12 Module Status Indication 23 Chapter3 BT Function 24 Chapter4 Antenna interface 24 4 1 Main Antenna Interface 24 4 1 1 Pin Description 24 4 1 2 Working Frequency Band 24 4 ...

Page 6: ...ei Xiamen China http en four faith com Tel 86 592 5907276 Fax 86 592 5912735 5 6 Receive Sensitivity 30 5 7 Electronic Static Discharge ESD 31 Chapter6 Dimensions 31 6 1 Module Dimensions 31 6 2 Module Package 32 Chapter7 Storage and Production 32 7 1 Storage 32 7 2 Product Welding 33 7 3 Package 34 ...

Page 7: ...ile and personal tracking service wearable service security systems wireless POS machine industrial grade PDA smart meter wireless remote control etc F B200GL is a SMD type module with 58 LCC pads which can be easily embedded into other products It integrates many network protocols such as TCP UDP CoAP MQTT LWM2M and the extended extension AT command makes these Internet protocols easier for users...

Page 8: ... Default baud rate is 57600bps UART2 Reserved UART3 Reserved UART4 Used for software download Module debug and log output AT Command The commands defined by 3GPP TS 27 007 and 3GPP TS 27 005 and add the new commands from Xiamen Four Faith Technology Antenna Interface Include the main antenna interface ANT_MAIN and the BT antenna interface ANT_BT Dimensions 15 2 0 15 mm 17 0 0 15 mm 2 6 0 2 mm Oper...

Page 9: ...l 86 592 5907276 Fax 86 592 5912735 Figure 1 1 F B200GL RF Block Diagram Chapter2 Application Interfaces F B200GL is an LCC footprint with 58 pins which can be used to wireless application platform and provide a functional interface as follows 1 Power supply interface 2 U SIM card interface 3 UART interface 4 I2 C interface 5 SPI interface ...

Page 10: ...tp en four faith com Tel 86 592 5907276 Fax 86 592 5912735 2 1 Pin Assignments Figure 2 1 F B200GL Pin Assignments NOTES 1 All the RESERVED and unused pins need to float 2 GND pins need to connect to ground 3 Due to diode drop of chipset inside The PWRKEY pin will output 1 0V 2 2 I O Definition Form 2 1 I O Definition ...

Page 11: ...T PI Power supply for module 3 4 4 2V 42 VDD_EXT PO Output 1 8 2 8V Pull up only for external GPIOS unused state float 7 15 16 24 27 29 31 41 47 58 GND Ground Module on off Pad Pad Name I O Description Remark 35 PWRKEY DI Turn on off signal 26 RESET_N DI Reset signal Unused state float Status indication Pad Pad Name I O Description Remark 10 STATUS DO Indicates working state VDD_EXT power domain u...

Page 12: ...und UART1 interface Pad Pad Name I O Description Remark 12 UART1_RXD DI Data receive VDD_EXT power domain unused state float 11 UART1_TXD DO Data transmit VDD_EXT power domain unused state float 18 UART1_CTS DO Clear to send VDD_EXT power domain unused state float 17 UART1_RTS DI Require to send VDD_EXT power domain unused state float UART2 interface Pad Pad Name I O Description Remark 19 UART2_TX...

Page 13: ...n unused state float I2C interface Pad Pad Name I O Description Remark 21 I2C_SCL OD I2C serial clock VDD_EXT power domain unused state float 22 I2C_SDA OD I2C serial data VDD_EXT power domain unused state float Antenna interface Pad Pad Name I O Description Remark 28 ANT_MAIN IO Main antenna interface 30 ANT_BT IO BT antenna interface Unused state float Other pins Pad Pad Name I O Description Rem...

Page 14: ...tiate the parameters related to e I DRX through attachment and TAU process Airplane Mode AT CFUN 4 command can make the module into airplane mode and in this mode the RF function is closed Minimum Functional Mode Using AT CFUN 0 command can make the module into Minimum Functional Mode with constant electricity In this mode the RF and U SIM card function are off but the GPIOS and USB can still work...

Page 15: ...ed off when the F B200GL module enters into airplane mode and all related AT commands are not accessible You can make the module into airplane mode by software You can send AT CFUN fun command into this mode The parameters of fun can be set 0 1 or 4 1 AT CFUN 0 Minimum functional mode RF and U SIM card are off 2 AT CFUN 1 all functions mode default 3 AT CFUN 4 RF is off airplane mode 2 5 3 Power S...

Page 16: ...Vnorm 3 8V 7 15 16 24 27 29 31 41 47 58 GND Ground 2 6 2 Power Supply Reference Design F B200GL power supply range is 3 4 4 2V need to ensure input voltage not less than 3 4V To reduce voltage dropping it is recommended to place a low ESR 100uF filter capacitor and three ceramic capacitors 100nF 33pF and 10pF near the VBAT pin When the module connection external power supply the line width of VBAT...

Page 17: ...rive circuit to control the PWRKEY pin You can release the PWRKEY pin after the STATUS pin is high Form 2 5 PWRKEY Pin Description Pad Pin Name Description DC character Remark 35 PWRKEY Used for the module startup shutdown VIH max 2 1V VIH min 1 3V VIL max 0 5V Due to diode voltage drop of chipset inside this pin will output 1 0V Reference Design Figure 2 3 Open Collector Drive Circuit Reference A...

Page 18: ... so it is recommended that the wiring on the interface board of the module should be as short as possible and the trace should be surrounded by GND AT reset command AT TRB Form 2 6 RESET_N Pin Description Pad Pad Name I O Description DC Characteristic Remark 26 RESET_N DI Reset signal VIH max 2 1V VIH min 1 3V Unused state float The reference circuit is similar to the PWRKEY control circuit you ca...

Page 19: ...etection 1 USIM_VDD PO U SIM power supply Support 1 8V and 2 85V voltage 44 USIM_RST DO U SIM reset signal 45 USIM_DATA IO U SIM data signal 46 USIM_CLK DO U SIM clock signal 2 USIM_GND U SIM s dedicated GND The F B200GL module can support U SIM card hot plug function and support high and low levels detection through the USIM_DETECT pin This function is closed by default The 8 pin U SIM connector ...

Page 20: ...d close to the USIM card connector if the system is complete on the client motherboard the USIM_GND can connect directly to the system ground 4 In order to prevent the signal mutual crosstalk between the USIM_CLK and the USIM_DATA they cannot route too close and the ground shielded should be add between the USIM_CLK and the USIM_DATA otherwise the USIM_RST signal also need to be protected by groun...

Page 21: ... output Form 2 9 UART1 Pins Description Pad Pad Name I O Description Remark 12 UART1_RXD DI Transmit data VDD_EXT power domain Unused state float 11 UART1_TXD DO Receive data VDD_EXT power domain Unused state float 18 UART1_CTS DO Send to clear VDD_EXT power domain Unused state float 17 UART1_RTS DI Require send data VDD_EXT power domain Unused state float Form 2 10 UART2 Pins Description Pad Pad ...

Page 22: ...x Unit VIL 0 3 0 6 V VIH 1 2 2 0 V VOL 0 0 45 V VOH 1 35 1 8 V The UART voltage of F B200GL is 1 8V 2 8V so if the customer host system level is 3 3V it is necessary to add a level converter in the serial port connection between the module and the host The converter device recommended the TXS0108EPWR of TI company The level conversion chip reference circuit design as follows Figure 2 10 The Level ...

Page 23: ... resistance Pad Name I O Description Remark 21 I2C_SCL OD I2C serial clock VDD_EXT power domain Unused state float 22 I2C_SDA OD I2C serial data VDD_EXT power domain Unused state float 2 12 Module Status Indication The STATUS pin is used to indicate the module working state The STATUS will output high level when the module turns on normally Form 2 14 STATUS Pin Description Pad Pad Name I O Descrip...

Page 24: ... 4 1 Main Antenna Pin Description Pin No Pin name I O Description DC Character 28 ANT_MAIN IO Main antenna interface 50Ω characteristic impedance 4 1 2 Working Frequency Band Form 4 2 Module Working Frequency Band Frequency Band FUL_low FUL_high FDL_low FDL_high Unit LTE FDD B1 1920 1980 2110 2170 MHz LTE FDD B3 1710 1785 1805 1880 MHz LTE FDD B5 824 849 869 894 MHz LTE FDD B8 880 915 925 960 MHz ...

Page 25: ...deline All the RF signal traces should be kept the characteristic impedance at 50Ω and the impedance depends on substrate dielectric trace width W ground separation S and substrate height H PCB characteristic impedance is usually controlled by the microstrip line and coplanar waveguide In order to reflect design principles below shows the microstrip line and coplanar waveguide structure design whe...

Page 26: ... used impedance simulation tools to accuracy controlled impedance in 50Ω of the RF signal lines 2 The GND pin adjacent to RF pins do not make the thermal pads and should be fully in contact with the ground 3 The distance between the RF pin and the RF connector shall be as short as possible and avoid the right angle trace it is recommended trace angle is 135 degrees 4 When the connection device pac...

Page 27: ...ion DC Characteristic Remark 30 ANT_BT IO BT antenna interface 50Ω impedance Unused state float 4 2 2 BT Antenna Interface Reference Design Figure 4 6 BT Antenna Interface Reference Design 4 3 Antenna Connector The requirement of main antenna and GNSS antenna are shown as follows Form 4 5 Antenna Requirement Type Requirement NB Antenna VSWR 2 Gain dBi 1 Maximum input power 50W Input impedance 50Ω ...

Page 28: ...28 34 Add Floor 11 Area A06 No 370 chengyi street Jimei Xiamen China http en four faith com Tel 86 592 5907276 Fax 86 592 5912735 VSWR 2 typical value The RF Connector recommend to use Hirose UF L R SMT Figure 4 7 UF L R SMT Connector Size Unit mm ...

Page 29: ...L Power Supply Parameter Description Condition Minimum Typical Maximum Unit VBAT Main power supply The actual input voltage must be in this range 3 4 3 8 4 2 V IVBAT Peak current LTE Cat NB Maximum output power is 23dBm 170 TBD mA 5 3 Operating Temperature Form 5 3 Operating Temperature Parameter Minimum Typical Maximum Unit Normal operating temperature1 20 25 70 Extended operating temperature 2 4...

Page 30: ...indexes of the module still meet the 3GPP standard 5 4 Power Consumption Form 5 4 Power Consumption Parameter Description Condition Typical Unit IVBAT Power off Power off mode 4 6 uA Minimum functional mode AT CFUN 0 GPIOs and USB unconnected 12 5 mA Power saving mode PSM LTE Cat NB1 network 4 uA Standby mode e I DRX 20 48s LTE Cat NB1 network UART and USB do not connect 0 78 mA LTE Cat NB1 data t...

Page 31: ...pecially in product design such as at the junction of the circuit design and the points susceptible to damage or influence by electrostatic discharge anti static protection should be added anti static gloves should be worn during production The ESD tolerance voltage of the important pin of the module as follows Form 5 7 ESD Performance Parameters Temperature 25 C Humidity 45 Test Pins Contact Disc...

Page 32: ...uum sealed bag module storage conditions are shown as follows 1 Temperature 40 C and air humidity 90 modules can be stored in a vacuum sealed bag for 12 months 2 After opening the vacuum sealed bag if the following conditions are met the module can directly carry out reflow soldering or other high temperature processes Storage air humidity 10 Environmental temperature 30 C air humidity 60 finish S...

Page 33: ... only takes a short time to bake please reference the IPC JEDECJ STD 033 standard 7 2 Product Welding Use the printing scraper to print the solder paste on the screen plate so that the solder paste can leak onto the PCB through the opening of the screen plate And the strength of the printing scraper should be adjusted properly In order to guarantee the quality of the printing paste the thickness o...

Page 34: ...m Tel 86 592 5907276 Fax 86 592 5912735 7 3 Package F B200GL module is packaged in pallet and sealed in a vacuum sealing bag It is recommended to open the vacuum packaging when actual production is used Each pallet is 194 21mm long and 184 18mm width include 49 F B200GL modules The pallet size is shown as follows Figure 7 2 Pallet Size ...

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