SOLDERING & HANDLING
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
is a registered
trademark and the Cree logo is a trademark of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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Cree
®
High‑Brightness LED
Soldering & Handling
Features
The purpose of this document is to provide customers and users with a clear understanding about the ways to use our LEDs
appropriately.
Description
Generally, LEDs can be used the same way as other general-purpose semiconductors. When using Cree LEDs, the following precautions
must be taken to protect the LED.
P2 AND P4 LEDS
1. Cleaning
•
Don’t use unspecified chemical liquids to clean the LED; the chemical could harm the LED. When washing is necessary, please
wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
•
The influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the way the LEDs are mounted.
Ultrasonic cleaning should be pre‑qualified to ensure this will not cause damage to the LEDs.
2. Forming
•
When forming leads, the leads should be bent at a point at least 3 mm from the base of the package.
•
Don’t form the leads during or after soldering. If forming is required, this must be done before soldering.
•
Avoid any bending stress to the LED package during leads forming.
•
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LEDs.
3. Storage
•
The shelf life of the LEDs is one year at 20~30 °C and <60% RH. If the LEDs are unpacked, the LEDs need to be stored in a sealed
container with desiccant (silica gel).
•
The lead may be affected by environments which contain corrosive substances. Please avoid conditions which may cause
the LEDs to corrode, tarnish or discolor. The corrosion or discoloration may cause difficulty during soldering operations. It is
recommended that the LEDs be used as soon as possible.
4. Soldering
•
A minimal cathode pad area of 0.18 × 0.18 inches squared is recommended for P2 LEDs and 0.18 × 0.18 inches squared × 2 for
P4 LEDs.
•
Soldering LEDs at not less than 3 mm from the base of the package and below the tie‑bar is recommended.
