Hardware Development Guide of Module Product
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(U)SIM card signal interface, the ESD device should be placed closely for protection.
Besides, on the side of main board, the user should reasonably design the structure
and PCB layout, guarantee that the metallic shielding shell is fully grounded, so as
to leave a smooth discharge channel for ESD.
7.5
Suggestions for PCB Wielding Panel Design
When the user is designing the encapsulation wielding panel on main board, the 30
heat wielding panels in the center are recommended to be designed according to
the dimensions as described in Figure 2-1. The surrounding 78 wielding panels
should be extended by more than 0.3mm, and the other three sides of the wielding
panel are extended by 0.05mm. For the right angles of wielding panels for the main
antenna PIN1 and A GPS antenna PIN70, they are recommended to be r ounded
into a round angel with a radius of 0.3mm. In this way, it is convenient for the import
of interference and the radiation of RF signal.
7.6
Suggestions for Heat-dissipation Design
The module will dissipate heat during the working process, and might also be
affected by other high-temperature devices. The heat dissipation is taken into full
consideration during the product design, as 30 heat wielding panels are reserved in
the center of the module. During the connection with the system board, make sure
that these wielding panes are grounded well, which is greatly helpful to heat
conductivity and heat balance, and is greatly beneficial to the electric performance
of the whole set as well.
Note:
1. Keep this product away from heat-dissipation devices with high power, to
prevent the temperature of the module from being too high. .
2. Do not put the module close to the large heat-dissipation devices, such as
CPU or bridge. The high temperature will affect the RF performance.
