CLM920_NC3_LTE Module hardware manual
Shanghai Yuge Information Technology co., LTD
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Chapter 7. Packaging and production
7.1 Chapter overview
Module packaging and storage
Production welding.
7.2 Module packaging and storage
The CLM920 NC3 module is packaged in a tray and packaged in a vacuum-sealed bag,
with a 10PCS package and a 100PCS package, shipped as a vacuum-sealed bag.
The storage of the CLM920 NC3 module module is subject to the following conditions
：
The module has a moisture sensitivity rating of 3 levels.
When the ambient temperature is less than 40 degrees Celsius and the air humidity is less
than 90%, the module can be stored in a vacuum sealed bag for 12 months.
When the vacuum sealed bag is opened, if the ambient temperature of the module is
lower than 30 degrees Celsius and the air humidity is less than 60%, the factory can
complete the patch within 72 hours, and the module can directly perform reflow soldering
or other high temperature process.
If the module is in other conditions, it needs to be baked before the patch.
If the module needs to be baked, please remove the module and bake it for 8 hours at 125
degrees Celsius (allowing fluctuations of up to 5 degrees Celsius).
7.3 Production welding
The CLM920 NC3 module is packaged in an anti-static tray. The SMT wire body needs
to be equipped with a Tray module. It is recommended to use a reflow oven above 7
temperature zones
：
To ensure the quality of the module paste, the thickness of the stencil corresponding to
the pad portion of the CLM920 NC3 module is recommended to be 0.18 mm.
The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
When the PCB is laid out on both sides, the LGA module layout must be machined on the
2nd side. Avoid module falling parts, welding and welding, and poor internal welding of
the module caused by the gravity of the module.