SERVICE MANUAL
PA
011553
HAMAMATSU, JAPAN
1.222K-496
Printed in Japan '00.11
CONTENTS
SPECIFICATIONS ···································································· 3
PANEL LAYOUT ······································································· 4
CIRCUIT BOARD LAYOUT ······················································ 5
WIRING····················································································· 6
DIMENTIONS ··········································································· 7
BLOCK DIAGRAM ···································································· 8
DISASSEMBLY PROCEDURE················································· 9
IC BLOCK DIAGRAM ····························································· 11
CIRCUIT BOARDS ································································· 12
INSPECTIONS········································································ 17
PARTS LIST
OVERALL CIRCUIT DIAGRAM
POWER AMPLIFIER
This document is printed on chlorine free (ECF) paper with soy ink.