14
Tyros2
MO
TR
OWNE
BEDIE
MODE
1.
Separating the Unit into the Upper Case
Assembly and the Lower Case Assembly
(Time required: About 3 minutes)
1-1
Remove the twenty one (21) screws marked [120].
(Fig.1)
1-2
Remove the six (6) screws marked [130]. (Fig.1)
1-3
Lay the unit right side up, lift the rear of the upper case
assembly and pull it diagonally downward to remove.
(Fig.2)
*
When installing the unit, tighten the six (6) screws
marked [130] first, and then tighten the screws marked
[120].
[120]
[120]
[120]
[130]
[110]
[110]
[130]
[120]
[120]
[100A]
HDD Cover
[120]
(Fig.1)
[100]: Bonding Screw 3.0X8 MFZN2B3 (WE997500)
[110]: Truss Head Tapping Screw-B 4.0X12 MFZN2B3 (WF010600)
[120]: Bind Head Tapping Screw-B 4.0X12 MFZN2B3 (WE998600)
[130]: Bind Head Tapping Screw-B 3.0X12 MFZN2B3 (WE998100)
2-2
Remove the thirty one (31) screws marked [240]. The
shield upper cover can then be removed. (Fig.3)
*
There are some products for which the shield upper
cover has not been used.
2-3
Remove the four (4) screws marked [610]. The DM
circuit board can then be removed. (Fig.4)
*
When installing the shield upper cover, insert the two
projections of the shield lower cover into the positioning
holes of the DM circuit board first. (Fig.4)
3.
DJK Circuit Board
(Time required: About 9 minutes)
3-1
Separate the unit into the upper case assembly and the
lower case assembly. (See procedure 1.)
3-2
Remove the DM circuit board. (See procedure 2.)
3-3
Remove the three (3) screws marked [530E], the eight
(8) screws marked [540A] and the two (2) hexagonal
locking screws marked [130].
The DJK circuit board can then be removed. (Fig.4,
Fig.5)
4.
DAC2 Circuit Board
(Time required: About 8 minutes)
4-1
Separate the unit into the upper case assembly and the
lower case assembly. (See procedure 1.)
4-2
Remove the DM circuit board. (See procedure 2.)
4-3
Remove the four (4) screws marked [530E]. The DAC2
circuit board can then be removed. (Fig.5)
(Fig.2)
2.
DM Circuit Board
(Time required: About 7 minutes)
2-1
Separate the main into the upper case assembly and the
lower case assembly. (See procedure 1.)