Winbond SpiFlash W25Q256FV, Manual

Page: 94 / 102

FOR MOBILE APPLICATIONS
W25Q256FV
- 93 -
9.4 DC Electrical Characteristics
PARAMETER SYMBOL CONDITIONS
SPEC
UNIT
MIN TYP MAX
Input Capacitance C
IN(1)
V
IN
= 0V
(1)
6 pF
Output Capacitance Cout
(1)
V
OUT
= 0V
(1)
8 pF
Input Leakage I
LI
±2 µA
I/O Leakage I
LO
±2 µA
Standby Current I
CC
1
/CS = VCC,
VIN = GND or VCC
10 50 µA
Power-down Current I
CC
2
/CS = VCC,
VIN = GND or VCC
1 20 µA
Current Read Data /
Dual /Quad 1MHz
(2)
I
CC
3
C = 0.1 VCC / 0.9 VCC
DO = Open
4 10 mA
Current Read Data /
Dual /Quad 50MHz
(2)
I
CC
3
C = 0.1 VCC / 0.9 VCC
DO = Open
15 mA
Current Read Data /
Dual /Quad 80MHz
(2)
I
CC
3
C = 0.1 VCC / 0.9 VCC
DO = Open
18 mA
Current Read Data /
Dual Output Read/Quad
Output Read 104MHz
(2)
I
CC
3
C = 0.1 VCC / 0.9 VCC
DO = Open
20 mA
Current Write Status
Register
I
CC
4 /CS = VCC
8 12 mA
Current Page Program I
CC
5 /CS = VCC 20 25 mA
Current Sector/Block
Erase
I
CC
6 /CS = VCC 20 25 mA
Current Chip Erase I
CC
7 /CS = VCC
20 25 mA
Input Low Voltage V
IL
–0.5 VCC x 0.3 V
Input High Voltage V
IH
VCC x 0.7 VCC + 0.4 V
Output Low Voltage V
OL
I
OL
= 100 µA 0.2 V
Output High Voltage V
OH
I
OH
= –100 µA VCC – 0.2 V
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.
2. Checker Board Pattern.