WAGO-I/O-SYSTEM 750
Device Description
21
753-647 DALI Multi-Master Module
Manual
Version 1.0.0
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3.5
Connectors
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3.5.1
Data Contacts/Internal Bus
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Communication between the coupler/controller and the bus modules as well as the
system supply of the bus modules is carried out via the internal bus. It is
comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
Figure 3: Data contacts
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Do not place the I/O modules on the gold spring contacts!
Do not place the I/O modules on the gold spring contacts in order to avoid soiling
or scratching!
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Ensure that the environment is well grounded!
The modules are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the modules, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.
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