Vertiv Liebert XD Series, System Design Manual

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Figure 3.1 Typical Liebert XDR piping—interlaced connections
3.5 Airflow Requirements for Liebert XD Solutions
Computer manufacturers typically specify a temperature change from intake to exhaust (delta T) of
18-27°F (10-15°C) for the air passing through a rack enclosure. The heat generated by electronic
equipment combined with the tight quarters of equipment cabinets mean high volumes of air must move
through an enclosure to meet this cooling specification.
A Liebert XD system can supply the cold air to satisfy this cooling demand, but airflow through the
enclosure must be adequate to extract the heat from the cabinet. Liebert’s XDA units can boost the
airflow to levels necessary to protect critical equipment. The Liebert XDA is particularly suited to the hot
aisle/cold aisle arrangement.
3.6 Liebert XDCF Placement
The Liebert XDCF is a self-contained module designed to cool Egenera’s BladeFrame EX cabinets and
equipment. Liebert XDCF modules attach to the rear of the Egenera BladeFrame EX cabinet, beside the
power modules (see Figure 3.2 on the facing page). No cutting or drilling is required to attach the
modules; all mounting holes, slots and pins required are fabricated at the factory. The Liebert XDCF does
not require electrical connections.
The number of Liebert XDCF modules required is determined by the heat load of the cabinet—cabinets
cannot share cooling from a Liebert XDCF module.
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