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8
Reflow Soldering
In order to avoid device falling off, the module should be placed on the top of the
main board during welding. Reflow soldering temperature curve is recommended
as shown in figure 8-1 below (M705-GRN360 is recommended for solder paste).
Figure 8-1 Reflow Soldering Profile
Note: The apertures in the stencil need to meet the customer's own design requirements
and inspection specifications, and the thickness of the stencil should be above 0.15mm,
and 0.18mm is recommended.
