Doc. No: Unex-HDG-20-001
11/11
A printed version of this document is an uncontrolled copy
© 2020 Unex Technology Corporation – Company Confidential
Pin
Symbol
Type
Pull
Drive
Strength
(mA)
Description
Power
Domain
93
N.C.
-
-
-
Non Connection
-
94
N.C.
-
-
-
Non Connection
-
95
GND
G
-
-
Ground
-
96
GND
G
-
-
Ground
-
97
GND
G
-
-
Ground
-
98
VDD_5V
P
-
-
5V Power Supply
-
99
VDD_5V
P
-
-
5V Power Supply
-
100
VDD_5V
P
-
-
5V Power Supply
-
7.3. Thermal Solution
Applying a soft silicone thermally conductive pad to fill the air gap between VTX-301
and its system board could help disperse heat generated by the VTX-301 to the system
board. It is recommended to keep continuous large copper pour area on the system PCB
underneath the VTX-301, better with exposed bare copper especially directly under the
CPU.
The distance between system board and CPU top surface is 3.7mm. Recommended
size of thermally conductive pad: 16x16x4mm.
Figure 5: Recommended Thermally Conductive Pad Area
7.4. Component Keep Out Area
In order to avoid interference with VTX-301, the system board side component height
underneath the VTX-301 should not exceed 3.0mm.
Thermally
Conductive
Pad Area
16x16x4mm
