- 25 -
C.
Cross-sectioning of Die / Packages
Cross-sections are much like backside thinning process, except the package is on its side. Follow the same
setup procedure as the backside thinning process. Mounting the sample would be done either with the
SEM stub holder that is correct for the user’s SEM, or the clamp work holder. The SEM stub holder would
work best with bare die, and the clamp work holder would work best with packaged and larger devices.
D.
Other Lapping & Polishing Applications
The need to produce surfaces by precision sawing, lapping and polishing operations is widespread
throughout manufacturing industry and research. ULTRA TEC designs, manufactures and provides
advanced surface preparation equipment and consumables for both routine and custom applications.
ULTRAPOL advance can be used for a wide range of lapping & polishing applications including:
TEM and pre-FIB Thinning
Waveguide Polishing
Wafer Polishing
Fiber Optic Component and connector polishing
For details of our ‘best-known’ techniques for any specific application, please contact ULTRA TEC
directly.
