TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R28
Design-in
Page 119 of 164
2.11
Module placement
An optimized placement allows a minimum RF line’s length and closer path from DC source for VCC /
3.3Vaux.
Make sure that the module, analog parts and RF circuits are clearly separated from any possible
source of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which
can produce Electro-Magnetic Interference that affects the module, analog parts and RF circuits’
performance. Implement proper countermeasures to avoid any possible Electro-Magnetic
Compatibility issue.
Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly
separated from any sensitive part / circuit which may be affected by Electro-Magnetic Interference,
or employ countermeasures to avoid any possible Electro-Magnetic Compatibility issue.
Provide enough clearance between the module and any external part.
☞
The heat dissipation during continuous transmission at maximum power can significantly raise
the temperature of the application base-board below the TOBY-L2 and MPCI-L2 series modules:
avoid placing temperature sensitive devices close to the module.
