SARA-G3 and SARA-U2 series - System Integration Manual
UBX-13000995 - R08
Objective Specification
Handling and soldering
Page 157 of 188
3.3.5
Repeated reflow soldering
Only a single reflow soldering process is encouraged for boards with a SARA-G3 and SARA-U2 series module
populated on it. The reason for this is the risk of the module falling off due to high weight in relation to the
adhesive properties of the solder.
3.3.6
Wave soldering
Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices
require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for
boards populated with SARA-G3 and SARA-U2 series modules.
3.3.7
Hand soldering
Hand soldering is not recommended.
3.3.8
Rework
Rework is not recommended.
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
3.3.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating products.
These materials affect the RF properties of the SARA-G3 and SARA-U2 series modules and it is important to
prevent them from flowing into the module.
The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore
care is required in applying the coating.
Conformal Coating of the module will void the warranty.
3.3.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the SARA-G3 and SARA-U2 series modules before implementing this in the
production.
Casting will void the warranty.
3.3.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox gives no warranty for damages to the SARA-G3 and SARA-U2 series modules caused by soldering
metal cables or any other forms of metal strips directly onto the EMI covers.
3.3.12
Use of ultrasonic processes
SARA-G3 and SARA-U2 series modules contain components which are sensitive to Ultrasonic Waves. Use of any
Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.
u-blox gives no warranty against damages to the SARA-G3 and SARA-U2 series modules caused by any
Ultrasonic Processes.
