NORA-W36 series - System integration manual
UBX-22021120 - R01
Handling and soldering
Page 30 of 48
C1-Public
☞
After reflow soldering, optical inspection of the modules is recommended to verify proper
alignment.
5.3.1
Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
•
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pins. Water will also
damage the sticker and the ink-jet printed text.
•
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the housing, areas that are not accessible for post-wash inspections. The solvent will also damage
the label and the ink-jet printed text.
•
Ultrasonic cleaning will permanently damage the module and the crystal oscillators in particular.
For best results use a
“
no-clean
”
soldering paste and circumvent the need for a cleaning stage after
the soldering process.
5.3.2
Other notes
•
Only a single-reflow soldering process
3
is allowed for boards with a module populated on it.
•
Boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices may require wave soldering to solder the THT components. Only a single
wave-soldering process is allowed for boards populated with the modules. Miniature Wave
Selective Solder processes are preferred over traditional wave soldering processes.
•
Hand-soldering is not recommended.
•
Rework is not recommended.
•
Conformal coating can affect the performance of the module, which means that it is important to
prevent the liquid from flowing into the module. The RF shields do
n’t
provide protection for the
module from coating liquids with low viscosity; therefore, care is required while applying the
coating. Conformal Coating of the module will void the warranty.
•
Grounding metal covers: Attempts to improve grounding by soldering ground cables, wick, or
other forms of metal strips directly onto the EMI covers is done so at the customer
’
s own risk and
will void the module warranty. The numerous ground pins are adequate to provide optimal
immunity to interferences.
•
The modules contain components which are sensitive to Ultrasonic Waves. Use of any Ultrasonic
Processes (cleaning, welding, etc.) may damage the module. The use of ultrasonic processes
during the integration of the module into an end product will void the warranty.
3
Two reflow soldering processes are planned to be supported.
