NINA-B1 series - System integration manual
UBX-15026175 - R16
Appendix
Page 55 of 63
C1-Public
Item
Value
T
Soldermask: 20 +/- 10 µm
Copper film and plating/surface coating: 35 +/- 15 µm
H
150 +/- 20 µm
ε
r
3.77 +/- 0.5
Table 13: Coplanar micro-strip specification
Figure 36 displays the minimum required GND trace required around the RF trace and pins. GND
stitching vias should be used around the RF trace to ensure a proper GND connection. No other
components are allowed within this area.
The solid GND layer beneath the ‘top layer’ shall surround at least the entire RF trace and connector.
No signal traces are allowed to be routed on the GND layer within this area but vias and small openings
are allowed.
Figure 36: RF trace and minimum required GND trace of the NINA-B111 external antenna reference design
