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TOBY-L1 and MPCI-L1 series - System Integration Manual

UBX-13001482 - R04

Advance Information

System description

Page 9 of 90

1.2

Architecture

Cellular

Base-band

Processor

Memory

Power Management Unit

26 MHz

32.768 kHz

ANT1

Transceiver

ANT2

V_INT (I/O)

V_BCKP

VCC (Supply)

SIM

USB

GPIO *

Power On

External Reset

LNA

Filter

Duplexer

Filter

LNA

Filter

Duplexer

Filter

LNA

Filter

LNA

Filter

Switch

Figure 1: TOBY-L100 block diagram

* = GPIOs are not supported by initial FW release.

ANT1

SIM

USB

LED_WWAN#

TOBY-L1

series

Signal

Conditioning

ANT2

W_DISABLE#

PERST#

U.FL

3.3Vaux (Supply)

Boost

Converter

VCC

Figure 2: MPCI-L100 block diagram

Summary of Contents for MPCI-L1 series

Page 1: ... of TOBY L1 and MPCI L1 series LTE cellular modules These modules are a complete and cost efficient 4G solution offering 100 Mb s download 50 Mb s upload and covering 2 LTE Bands in the compact TOBY form factor or in the industry standard PCI Express Mini Card MPCI form factor UBX 13001482 R04 TOBY L1 series MPCI L1 series www u blox com ...

Page 2: ... reserves all rights to this document and the information contained herein Products names logos and designs described herein may in whole or in part be subject to intellectual property rights Reproduction use modification or disclosure to third parties of this document or any part thereof without the express permission of u blox is strictly prohibited The information contained herein is provided a...

Page 3: ...ystem Integration Manual provides the necessary information to successfully design and configure the u blox cellular modules This manual has a modular structure It is not necessary to read it from the beginning to the end The following symbols are used to highlight important information within the manual An index finger points out key information pertaining to module integration and performance A ...

Page 4: ...1 6 1 Module power on 22 1 6 2 Module power off 25 1 6 3 Module reset 27 1 7 Antenna interface 29 1 7 1 Antenna RF interfaces ANT1 ANT2 29 1 8 SIM interface 32 1 8 1 SIM card interface 32 1 9 Data communication interfaces 32 1 9 1 Universal Serial Bus USB 32 1 10 General Purpose Input Output GPIO 33 1 11 Mini PCIe specific signals W_DISABLE LED_WWAN 34 1 12 Reserved pins RSVD 34 1 13 Not connected...

Page 5: ...14 1 ESD immunity test overview 69 2 14 2 ESD immunity test of TOBY L1 and MPCI L1 series reference designs 69 2 14 3 ESD application circuits 70 2 15 Schematic for TOBY L1 and MPCI L1 series module integration 72 2 16 Design in checklist 74 2 16 1 Schematic checklist 74 2 16 2 Layout checklist 74 2 16 3 Antenna checklist 75 3 Handling and soldering 76 3 1 Packaging shipping storage and moisture p...

Page 6: ... States only 81 4 2 2 Modifications 81 5 Product Testing 83 5 1 u blox in series production test 83 5 2 Test parameters for OEM manufacturer 84 5 2 1 Go No go tests for integrated devices 84 5 2 2 RF functional tests 84 5 2 3 Connecting to Wireless Communication Test Set 86 Appendix 87 A Glossary 87 Related documents 89 Revision history 89 Contact 90 ...

Page 7: ...signed in the industry standard PCI Express Full Mini Card form factor 51 x 30 mm easy to integrate into industrial and consumer applications and also ideal for manufacturing small series The modules are dedicated for data transfer supporting a high speed USB 2 0 interface With LTE Category 3 data rates of 100 Mb s downlink and 50 Mb s uplink they are ideal for applications requiring the highest d...

Page 8: ...restrial Radio Access E UTRA Frequency Division Duplex FDD Multi Input Multi Output MIMO 2 x 2 antenna support Band support Band 4 1710 1755 MHz Tx 2110 2155 MHz Rx Band 13 777 787 MHz Tx 746 756 MHz Rx Channel bandwidth Band 4 5 MHz 10 MHz 15 MHz 20 MHz Band 13 10 MHz Power class Class 3 23 dBm Data rate LTE category 3 up to 50 Mb s Up Link 100 Mb s Down Link Short Message Service SMS SMS via emb...

Page 9: ...ver ANT2 V_INT I O V_BCKP VCC Supply SIM USB GPIO Power On External Reset PA LNA Filter Filter Duplexer Filter PA LNA Filter Filter Duplexer Filter LNA Filter Filter LNA Filter Filter Switch Switch Figure 1 TOBY L100 block diagram GPIOs are not supported by initial FW release ANT1 SIM USB LED_WWAN TOBY L1 series Signal Conditioning ANT2 W_DISABLE PERST U FL U FL 3 3Vaux Supply Boost Converter VCC ...

Page 10: ...irect conversion Zero IF receiver Highly linear RF demodulator modulator capable QPSK 16QAM 64QAM Fractional N Sigma Delta RF synthesizer VCO Power Amplifiers PA amplify the Tx signal modulated by the RF transceiver RF switches connect primary ANT1 and secondary ANT2 antenna ports to the suitable Tx Rx path Low Noise Amplifiers LNA enhance the received sensitivity SAW duplexers separate the Tx and...

Page 11: ...Digital Interfaces supply output V_INT 1 8 V typical generated by internal regulator when the module is switched on See section 1 5 3 for functional description See section 2 2 3 for external circuit design in System PWR_ON 20 I Power on input High impedance input input voltage level has to be properly fixed e g adding an external pull up resistor to the V_BCKP output pin See section 1 6 1 for fun...

Page 12: ...ace for AT commands Data communication FOAT FW update by u blox tool and diagnostic 90 Ω nominal differential impedance Z0 30 Ω nominal common mode impedance ZCM Pull up or pull down resistors and external series resistors as required by the USB 2 0 specifications 4 are part of the USB pad driver and need not be provided externally See section 1 9 1 for functional description See section 2 6 1 for...

Page 13: ...imary antenna Main Tx Rx antenna interface 50 Ω nominal characteristic impedance Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes See section 1 7 for functional description requirements See section 2 4 for external circuit design in ANT2 U FL I Secondary antenna Rx only for DL MIMO 2x2 configuration 50 Ω n...

Page 14: ...pdate by u blox tool and diagnostic 90 Ω nominal differential impedance Z0 30 Ω nominal common mode impedance ZCM Pull up or pull down resistors and external series resistors as required by the USB 2 0 specifications 4 are part of the USB pad driver and need not be provided externally See section 1 9 1 for functional description See section 2 6 1 for external circuit design in Specific Signals LED...

Page 15: ... the TOBY L1 modules can be switched on by a low level on PWR_ON input refer to 1 6 1 module switches from power off to active mode When VCC supply is removed the TOBY L1 series module switches from power off mode to not powered mode Idle Mode Application interfaces are disabled the module does not accept data signals from an external device connected to the module The module automatically enters ...

Page 16: ...om idle to connected mode in case of necessary RF data Transmission Reception When a data connection is terminated the module returns to the idle mode Table 6 TOBY L1 and MPCI L1 series modules operating modes description Figure 3 describes the TOBY L1 and MPCI L1 series modules transitions between the different operating modes MPCI L1 Switch ON Apply 3 3Vaux If power saving is enabled and there i...

Page 17: ...ux supply circuit compliant to the requirements listed in Table 7 The supply circuit affects the RF compliance of the device integrating TOBY L1 and MPCI L1 series modules with applicable required certification schemes as well as antenna circuit design Compliance is guaranteed if the requirements summarized in the Table 7 are fulfilled Item Requirement Remark VCC or 3 3Vaux nominal voltage Within ...

Page 18: ...are logically divided into a slot of 0 5 ms time length of one Resource Block thus the rate of power change can reach a maximum rate of 2 kHz Figure 4 shows an example of the module current consumption profile versus time in LTE connected mode Detailed VCC or 3 3Vaux current consumption values can be found in the TOBY L1 series Data Sheet 1 or in the MPCI L1 series Data Sheet 2 Time ms Current mA ...

Page 19: ... activated during the paging block reception and automatically switches its reference clock frequency from 32 kHz to the 26 MHz used in active mode The time period between two paging block receptions is defined by the network This is the paging period parameter fixed by the base station through broadcast channel sent to all users on the same serving cell The time interval between two paging block ...

Page 20: ...he 26 MHz reference clock frequency is used It would draw more current during the paging period than that in the power saving mode Figure 6 illustrates a typical example of the module current consumption profile when power saving is disabled In such case the module is registered with the network and while active mode is maintained the receiver is periodically activated to monitor the paging channe...

Page 21: ...gital interfaces supply output V_INT V_INT output pin is not accessible on MPCI L1 series modules The V_INT output pin of the TOBY L1 series module is connected to an internal 1 8 V supply with current capability refer to TOBY L1 series Data Sheet 1 This supply is internally generated by a switching step down regulator integrated in the Power Management Unit and it is internally used to source the...

Page 22: ...gh level by the internal circuit Therefore the external circuit must be able to hold the high logic level stable e g providing an external pull up resistor for further design in guidelines refer to chapter 2 3 1 The PWR_ON input voltage thresholds are different from the other generic digital interfaces Detailed electrical characteristics are described in TOBY L1 series Data Sheet 1 Baseband Proces...

Page 23: ...ice enumeration timings The PWR_ON input can be released to the high logical level after at least 5 seconds The module is fully ready to operate after all interfaces are configured VCC V_BCKP RESET_N PWR_ON V_INT Internal Reset System State Digital Pins State Operational OFF Tristate Internal Reset Internal Reset Operational ON Start up event Start of interface configuration PWR_ON can be set high...

Page 24: ...guration phase differs within generic digital interfaces and the USB interface due to specific host device enumeration timings The module is fully ready to operate after all interfaces are configured 3 3Vaux PERST Internal Reset System State Digital Pins State Operational OFF Tristate Internal Reset Internal Reset Operational ON Start up event Start of interface configuration 0 ms 6 ms 5 ms 20 s A...

Page 25: ...tach It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY L1 modules normal operations the power off procedure must be started by the AT CPWROFF command waiting the command response for a proper time period and then a proper VCC supply has to be held at least until the end of the internal power off sequence which occurs when the generic digital interfaces supply output...

Page 26: ...nal Tristate AT CPWROFF sent to the module OK replied by the module VCC can be removed Figure 12 TOBY L1 series power off sequence description The Internal Reset signal is not available on a module pin but the application can monitor the V_INT pin to sense the end of the power off sequence Figure 13 describes the MPCI L1 power off procedure with the following phases When the AT CFUN 0 command is s...

Page 27: ...s procedure the current parameter settings are not saved in the module s non volatile memory and a proper network detach is not performed An abrupt hardware reset reboot occurs on MPCI L1 modules when a low level is applied on the PERST input pin for at least 1 second Implementing this procedure the current parameter settings are not saved in the module s non volatile memory and a proper network d...

Page 28: ...erational ON Tristate Operational Start up event Start of interface configuration PWR_ON can be released All interfaces are configured RESET_N set low RESET_N can be released 5 s 1 s Figure 15 TOBY L1 hardware reset reboot sequence description Figure 16 describes the hardware reset reboot sequence of MPCI L1 modules with the following main phases PERST pin set low for at least 1 second causing mod...

Page 29: ...eception The ANT2 Hirose U FL R SMT coaxial connector receptacle of MPCI L1 series modules have a nominal characteristic impedance of 50 Ω and must be connected to the secondary Rx antenna through a mated RF plug with a 50 Ω coaxial cable assembly to allow proper RF reception The Multiple Input Multiple Output MIMO radio technology is an essential component of LTE radio systems based on the use of...

Page 30: ... impedance of the ANT1 pin connector The impedance of the antenna termination must match as much as possible the 50 Ω nominal impedance of the ANT1 pin connector over the operating frequency range reducing as much as possible the amount of reflected power Efficiency 1 5 dB 70 recommended 3 0 dB 50 acceptable The radiation efficiency is the ratio of the radiated power to the power delivered to ante...

Page 31: ... range to comply with the Over The Air OTA radiated performance requirements as the TIS specified by applicable related certification schemes Table 9 Summary of secondary Rx antenna RF interface ANT2 requirements Item Requirements Remarks Efficiency imbalance 0 5 dB recommended 1 0 dB acceptable The radiation efficiency imbalance is the ratio of the primary ANT1 antenna efficiency to the secondary...

Page 32: ...lude a high speed USB 2 0 compliant interface with maximum throughput of 480 Mb s between the module and a host processor USB_D USB_D pins carry the USB serial data and signaling The module itself acts as a USB device and can be connected to any USB host such as a Personal Computer or an embedded application microprocessor Figure 18 describes the USB end points that TOBY L1 and MPCI L1 series modu...

Page 33: ...T UPSV 1 the TOBY L1 or MPCI L1 series module automatically enters the USB suspended state when the device has observed no bus traffic for a specified period refer to the Universal Serial Bus Revision 2 0 specification 4 In suspended state the module maintains any internal status as USB device including its address and configuration In addition the module enters the suspended state when the hub po...

Page 34: ...e PCI Express Mini Card Electromechanical Specification 15 For details of the indicator protocol used please see Section 1 14 1 For more electrical characteristics details refer to the MPCI L1 series Data Sheet 2 1 12 Reserved pins RSVD Pins reserved for future use marked as RSVD are not accessible on MPCI L1 series modules TOBY L1 modules have pins reserved for future use RSVD to be left unconnec...

Page 35: ... with AT UGPIOC command For the details please refer to TOBY L1 MPCI L1 series AT Commands Manual 2 1 14 2 Power saving The power saving configuration is by default disabled but it can be enabled using the AT UPSV command for the complete description of the AT UPSV command refer to the TOBY L1 MPCI L1 series AT Commands Manual 3 When power saving is enabled the module automatically enters the low ...

Page 36: ...tenna circuit design Very carefully follow the suggestions provided in the chapter 2 2 1 for schematic and layout design 3 USB interface USB_D USB_D pins Accurate design is required to guarantee USB 2 0 high speed interface functionality Carefully follow the suggestions provided in the chapter 2 6 1 for schematic and layout design 4 SIM interface VSIM SIM_CLK SIM_IO SIM_RST or UIM_PWR UIM_DATA UIM...

Page 37: ...inear LDO Regulator Main Supply Voltage 5 V Switching Step Down Regulator No portable device No less than 5 V Yes greater than 5 V Yes always available Figure 19 VCC 3 3Vaux supply concept selection The DC DC switching step down regulator is the typical choice when the available primary supply source has a nominal voltage much higher e g greater than 5 V than the modules VCC or 3 3aux operating su...

Page 38: ...ail to the VCC or 3 3Vaux value is high since switching regulators provide good efficiency transforming a 12 V or greater voltage supply to a suggested 4 1 V value for the VCC supply or a suggested 3 44 V value for the 3 3Vaux supply The characteristics of the switching regulator connected to VCC or 3 3Vaux pins should meet the following prerequisites to comply with the module VCC or 3 3Vaux requi...

Page 39: ...GND 41 3 3Vaux 52 3 3Vaux Figure 20 Suggested schematic design for the VCC and 3 3Vaux voltage supply application circuit using a step down regulator Reference Description Part Number Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15 50 V C5750X7R1H106MB TDK C2 10 nF Capacitor Ceramic X7R 0402 10 16 V GRM155R71C103KA01 Murata C3 680 pF Capacitor Ceramic X7R 0402 10 16 V GRM155R71H681KA01 Murata ...

Page 40: ...he components listed in Table 12 show an example of VCC or 3 3Vaux module supply circuit using an LDO linear regulator capable of delivering the required current with proper power handling capability It is recommended to configure the LDO linear regulator to generate a voltage supply value slightly below the maximum limit of the module VCC or 3 3Vaux normal operating range e g 4 1 V for VCC and 3 ...

Page 41: ...e non rechargeable battery with its output circuit must be capable of avoiding a VCC voltage drop below the operating range specified in TOBY L1 series Data Sheet 1 during transmit 2 2 1 6 Additional guidelines for VCC supply circuit design To reduce voltage drops use a low impedance power source The resistance of the power supply lines connected to the VCC 3 3Vaux and GND pins of the module on th...

Page 42: ...an on board charging circuit Figure 23 provides an example of a battery charger design suitable for applications that are battery powered with a Li Ion or Li Polymer cell In the application circuit a rechargeable Li Ion or Li Polymer battery cell that features proper pulse and DC discharge current capabilities and proper DC series resistance is directly connected to the VCC supply input of TOBY L1...

Page 43: ...C0402JR 0724KL Yageo Phycomp R3 3 3 kΩ Resistor 0402 5 0 1 W RC0402JR 073K3L Yageo Phycomp R4 1 0 kΩ Resistor 0402 5 0 1 W RC0402JR 071K0L Yageo Phycomp U1 Single Cell Li Ion or Li Polymer Battery Charger IC L6924U STMicroelectronics Table 14 Suggested components for Li Ion or Li Polymer battery charging application circuit 2 2 1 8 Guidelines for VCC or 3 3Vaux supply layout design A good connecti...

Page 44: ...erwise protection functionality may be compromised 2 2 1 9 Guidelines for grounding layout design Good connection of the module GND pins with application board solid ground layer is required for correct RF performance It significantly reduces EMC issues and provides a thermal heat sink for the module Connect each GND pin with application board solid GND layer It is strongly recommended that each G...

Page 45: ...V_INT pin is not accessible on MPCI L1 series modules 2 2 3 1 Guidelines for V_INT circuit design TOBY L1 series modules provide the V_INT digital interfaces 1 8 V supply output which can be mainly used to Supply voltage translators to connect 1 8 V digital interfaces of the module to a 3 0 V device Indicate when the module is switched on V_INT supply output pin provides internal short circuit pro...

Page 46: ...stor array close to accessible point Using an open drain output from a host to connect the PWR_ON input to an application processor in couple with an external pull up resistor e g 100 kΩ biased by the V_BCKP supply pin of the module as described in Figure 24 and Table 15 A compatible push pull output of an application processor can also be used In this case the pull up can be provided to pull the ...

Page 47: ... ESD sensitivity rating of the RESET_N and PERST pin is 1 kV Human Body Model according to JESD22 A114 Higher protection level can be required if the line is externally accessible on the application board e g if an accessible push button is directly connected to RESET_N or PERST pin Higher protection level can be achieved by mounting an ESD protection e g EPCOS CA05P4S14THSG varistor array close t...

Page 48: ... access on the application board by means of an accessible test point directly connected to the RESET_N pin 2 3 2 2 Guidelines for RESET_N and PERST layout design The RESET_N and PERST circuits requires careful layout due to the pin function ensure that the voltage level is well defined during operation and no transient noise is coupled on this line otherwise the module might detect a spurious res...

Page 49: ...s External antennas e g linear monopole o External antennas basically do not imply physical restriction to the design of the PCB where the TOBY L1 and MPCI L1 series module is mounted o The radiation performance mainly depends on the antennas It is required to select antennas with optimal radiating performance in the operating bands o RF cables should be carefully selected with minimum insertion l...

Page 50: ...priate gain figure i e combined antenna directivity and efficiency figure so that the electromagnetic field radiation intensity do not exceed the regulatory limits specified in some countries e g by FCC in the United States as reported in the chapter 4 2 1 Select antennas capable to provide low Envelope Correlation Coefficient between the primary ANT1 and the secondary ANT2 antenna the 3D antenna ...

Page 51: ...cally from 0 8 mm to 1 37 mm Select thicker cables to minimize insertion loss Cable length standard length is typically 100 mm or 200 mm custom lengths may be available on request Select shorter cables to minimize insertion loss RF connector on the other side of the cable for example another U FL for board to board connection or SMA for panel mounting For applications requiring an internal integra...

Page 52: ... um 500 um Figure 28 Example of 50 Ω coplanar waveguide transmission line design for the described 4 layer board layup 35 um 35 um 1510 um L2 Copper L1 Copper FR 4 dielectric 1200 um 400 um 400 um Figure 29 Example of 50 Ω coplanar waveguide transmission line design for the described 2 layer board layup If the two examples do not match the application PCB stack up the 50 Ω characteristic impedance...

Page 53: ... as smoothly as possible avoid abrupt changes of width and spacing to GND Add GND stitching vias around transmission lines as described in Figure 30 Ensure solid metal connection of the adjacent metal layer on the PCB stack up to main ground layer providing enough vias on the adjacent metal layer as described in Figure 30 Route RF transmission lines far from any noise source as switching supplies ...

Page 54: ... of the application PCB can be reduced down to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated As numerical example Frequency 750 MHz Wavelength 40 cm Minimum GND plane size 10 cm It is highly recommended to strictly follow the detailed and specific guidelines provided by the antenna manufacturer regarding correct installation and d...

Page 55: ...module as described above Removable SIM card are suitable for applications where the SIM changing is required during the product lifetime A SIM card holder can have 6 or 8 positions if a mechanical card presence detector is not provided or it can have 6 2 or 8 2 positions if two additional pins related to the normally open mechanical switch integrated in the SIM connector for the mechanical card p...

Page 56: ...h externally accessible SIM line close to each related pad of the SIM connector ESD sensitivity rating of the SIM interface pins is 1 kV HBM So that according to EMC ESD requirements of the custom application higher protection level can be required if the lines are externally accessible on the application device Limit capacitance and series resistance on each SIM signal to match the SIM requiremen...

Page 57: ...revent RF coupling especially in case the RF antenna is placed closer than 10 30 cm from the SIM lines Limit capacitance and series resistance on each SIM signal to match the SIM requirements 27 7 ns is the maximum allowed rise time on clock line 1 0 µs is the maximum allowed rise time on data and reset lines TOBY L1 series 59 VSIM 57 SIM_IO 56 SIM_CLK 58 SIM_RST SIM CHIP SIM Chip Bottom View cont...

Page 58: ...avoid coupling with RF line or sensitive analog inputs In the second case the same harmonics can be picked up and create self interference that can reduce the sensitivity of LTE receiver channels whose carrier frequency is coincidental with harmonic frequencies It is strongly recommended to place the RF bypass capacitors suggested in Figure 31 near the SIM connector In addition since the SIM card ...

Page 59: ... rating is 1 kV Human Body Model according to JESD22 A114F Higher protection level could be required if the lines are externally accessible on the application board Higher protection level can be achieved by mounting a very low capacitance i e less or equal to 1 pF ESD protection e g Tyco Electronics PESD0402 140 ESD protection device on the lines connected to these pins close to accessible points...

Page 60: ... possible to 90 Ω Ensure the common mode characteristic impedance ZCM is as close as possible to 30 Ω Consider design rules for USB_D USB_D similar to RF transmission lines being them coupled differential micro strip or buried stripline avoid any stubs abrupt change of layout and route on clear PCB area Figure 34 and Figure 35 provide two examples of coplanar waveguide designs with differential ch...

Page 61: ...es modules Network indication function provided by the GPIO1 pin TOBY L1 series R1 R3 4V0 Network Indicator R2 21 GPIO1 DL1 T1 Figure 36 GPIO application circuit Reference Description Part Number Manufacturer R1 10 kΩ Resistor 0402 5 0 1 W Various manufacturers R2 47 kΩ Resistor 0402 5 0 1 W Various manufacturers R3 820 Ω Resistor 0402 5 0 1 W Various manufacturers DL1 LED Red SMT 0603 LTST C190KR...

Page 62: ...ly accessible on the application board e g if an accessible push button is directly connected to the W_DISABLE pin and it can be achieved by mounting an ESD protection e g EPCOS CA05P4S14THSG varistor close to accessible point An open drain output is suitable to drive the W_DISABLE input from an application processor as it is equipped with an internal pull up to the 3 3Vaux supply as described in ...

Page 63: ...R 3V3 DL 42 LED_WWAN MPCI L1 series Figure 38 LED_WWAN application circuit Reference Description Remarks DL LED Green SMT 0603 LTST C190KGKT Lite on Technology Corporation R 470 Ω Resistor 0402 5 0 1 W Various manufacturers Table 23 Example of components for the LED_WWAN application circuit ESD sensitivity rating of the LED_WWAN pin is 1 kV Human Body Model according to JESD22 A114 Higher protecti...

Page 64: ... module RF and analog parts circuits are clearly separated from any possible source of radiated energy including digital circuits that can radiate some digital frequency harmonics which can produce Electro Magnetic Interference affecting module RF and analog parts circuits performance or implement proper countermeasures to avoid any possible Electro Magnetic Compatibility issue Make sure that the ...

Page 65: ...2 1 30 mm L 7 15 mm P2 1 25 mm G 1 10 mm M1 1 80 mm P3 2 85 mm Table 24 TOBY L1 module suggest footprint dimensions The Non Solder Mask Defined NSMD pad type is recommended over the Solder Mask Defined SMD pad type implementing the solder mask opening 50 µm larger per side than the corresponding copper pad The suggested paste mask layout for TOBY L1 series modules slightly reflects the copper mask...

Page 66: ... PCI Express Full Mini card modules Manufacturer Part Number Description JAE Electronics MM60 series 52 circuit 0 8 mm pitch PCI Express Mini card edge female connector Molex 67910 series 52 circuit 0 8 mm pitch PCI Express Mini card edge female connector TE Connectivity AMP 2041119 series 52 circuit 0 8 mm pitch PCI Express Mini card edge female connector FCI 10123824 series 52 circuit 0 8 mm pit...

Page 67: ...ions during RF connector mating To unplug the RF cable assembly it is encouraged to use a suitable extraction tool for the RF connector such as the Hirose U FL LP N or the Hirose U FL LP V N extraction jig according to the RF cable assembly type used Hook the end portion of the extraction jig onto the connector cover and pull off vertically in the direction of the connector mating axis as describe...

Page 68: ...emperature This improves the device long term reliability for applications operating at high ambient temperature A few hardware techniques may be used to reduce the Module to Ambient thermal resistance in the application Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete thermal via stacked down to ma...

Page 69: ... depends on the device classification as defined by ETSI EN 301 489 1 7 Applicability of ESD immunity test to the related device ports or the related interconnecting cables to auxiliary equipment depends on device accessible interfaces and manufacturer requirements as defined by ETSI EN 301 489 1 7 Contact discharges are performed at conductive surfaces while air discharges are performed at insula...

Page 70: ...faces Enclosure port Not Applicable Test not applicable to the u blox reference design because it does not provide an enclosure surface The test is applicable only to equipment providing insulating enclosure surface Antenna port 8 kV 8 kV Test applicable to u blox reference design because it provides antenna with conductive insulating surfaces The test is applicable only to equipment providing ant...

Page 71: ...pins are externally accessible on the application board The following precautions are suggested to achieve higher protection level A low capacitance i e less than 10 pF ESD protection device e g Tyco Electronics PESD0402 140 should be mounted on each SIM interface line close to accessible points i e close to the SIM card holder The SIM interface application circuit implemented in the EMC ESD appro...

Page 72: ... VCC 70 VCC 3 V_BCKP 23 RESET_N Application Processor Open Drain Output 20 PWR_ON 100kΩ Open Drain Output GND GND USB 2 0 Host D D 27 USB_D 28 USB_D 68pF 47pF SIM Card Connector CCVCC C1 CCVPP C6 CCIO C7 CCCLK C3 CCRST C2 GND C5 47pF 47pF 100nF 59 VSIM 57 SIM_IO 56 SIM_CLK 58 SIM_RST 47pF 5 V_INT ESD ESD ESD ESD 81 ANT1 87 ANT2 Primary Antenna TP TP TP Secondary Antenna 21 GPIO1 4V0 Network Indica...

Page 73: ...1 series Application Processor Open Drain Output 22 PERST GND GND USB 2 0 Host D D 27 USB_D 28 USB_D 68pF Primary Antenna Secondary Antenna 42 LED_WWAN 20 W_DISABLE Open Drain Output 24 3 3Vaux 39 3 3Vaux 2 3 3Vaux 41 3 3Vaux 52 3 3Vaux 3V3 NC 47pF SIM Card Connector CCVCC C1 CCVPP C6 CCIO C7 CCCLK C3 CCRST C2 GND C5 47pF 47pF 100nF 8 UIM_PWR 10 UIM_DATA 12 UIM_CLK 14 UIM_RESET 47pF ESD ESD ESD ES...

Page 74: ... specifications Insert the suggested capacitors on each SIM signal and low capacitance ESD protections if accessible For TOBY L1 series modules provide accessible test points directly connected to the following pins V_INT PWR_ON RESET_N and to RSVD pins 16 17 49 for diagnostic purpose Provide proper precautions for ESD immunity as required on the application board All unused pins can be left uncon...

Page 75: ...nce with VSWR at least less than 3 1 recommended 2 1 on operating bands in deployment geographical area Follow the recommendations of the antenna producer for correct antenna installation and deployment PCB layout and matching circuitry Follow the additional guidelines for products marked with the FCC logo United States only reported in chapter 4 2 1 Ensure high and similar efficiency for both the...

Page 76: ... small working station or a large manufacturing area The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics all conductive materials are grounded workers are grounded and charge build up on ESD sensitive electronics is prevented International standards are used to define typical EPA and can be obtained for example from International Electrotechni...

Page 77: ...d surface color Consider the IPC 7530 Guidelines for temperature profiling for mass soldering reflow and wave processes published 2001 Reflow profiles are to be selected according to the following recommendations Failure to observe these recommendations can result in severe damage to the device Preheat phase Initial heating of component leads and balls Residual humidity will be dried out Note that...

Page 78: ...modules inspect the modules optically to verify that the module is properly aligned and centered 3 3 4 Cleaning Cleaning the soldered modules is not recommended Residues underneath the modules cannot be easily removed with a washing process Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module The combination of residues of solde...

Page 79: ... viscosity therefore care is required in applying the coating Conformal Coating of the module will void the warranty 3 3 10 Casting If casting is required use viscose or another type of silicon pottant The OEM is strongly advised to qualify such processes in combination with the TOBY L1 and MPCI L1 series modules before implementing this in the production Casting will void the warranty 3 3 11 Grou...

Page 80: ... Even if TOBY L1 and MPCI L1 series modules are approved under all major certification schemes the application device that integrates TOBY L1 and MPCI L1 series modules must be approved under all the certification schemes required by the specific application device to be deployed in the market The required certification scheme approvals and related testing specifications differ depending on the co...

Page 81: ...e gain of the system antenna s used for the TOBY L1 and MPCI L1 series modules i e the combined transmission line connector cable losses and radiating element gain must not exceed 10 7 dBi for LTE band 13 and 6 57 dBi for LTE band 4 for mobile and fixed or mobile operating configurations 4 2 2 Modifications The FCC requires the user to be notified that any changes or modifications made to this dev...

Page 82: ...tes o cet appareil ne doit pas causer d interférence o cet appareil doit accepter toute interférence notamment les interférences qui peuvent affecter son fonctionnement Informations concernant l exposition aux fréquences radio RF La puissance de sortie émise par l appareil de sans fil u blox Cellular Module est inférieure à la limite d exposition aux fréquences radio d Industrie Canada IC Utilisez...

Page 83: ...e 47 illustrates typical production automatic test equipment ATE in production line The following typical tests are among the production tests Digital self test firmware download Flash firmware verification IMEI programming Measurement of voltages and currents Adjustment of ADC measurement interfaces Functional tests USB interface communication SIM card communication Digital tests GPIOs Measuremen...

Page 84: ...his 5 2 1 Go No go tests for integrated devices A Go No go test is typically to compare the signal quality with a Golden Device in a location with excellent network coverage and known signal quality This test should be performed after data connection has been established AT CSQ is the typical AT command used to check signal quality in term of RSSI Refer to TOBY L1 MPCI L1 series AT Commands Manual...

Page 85: ...ring LTE signaling protocol This emission can generate interference that can be prohibited by law in some countries The use of this feature is intended for testing purpose in controlled environments by qualified user and must not be used during the normal module operation Follow instructions suggested in u blox documentation u blox assumes no responsibilities for the inappropriate use of this feat...

Page 86: ...e 28 Step AT Command Syntax Response Description 1 AT SETCFG vzw_mode 0 OK Disable the IMS client 2 AT SETCFG enable_test_mode 0 OK Disable test mode for conformance testing By default it is disabled This step is to ensure this mode is turned off 3 AT SETACFG service ECM Enabled true OK Enable the embedded connection manager 4 AT SETACFG ecm Mode AutoConnectMode true OK Enable Auto Connect 5 AT SE...

Page 87: ...ment EMC Electro magnetic Compatibility EMI Electro magnetic Interference ESD Electro static Discharge ESR Equivalent Series Resistance E UTRA Evolved Universal Terrestrial Radio Access FDD Frequency Division Duplex FEM Front End Module FOAT Firmware Over AT commands FTP File Transfer Protocol FW Firmware QPSK 16 QAM Quadrature Phase Shift Keying 16 state Quadrature Amplitude Modulation GND Ground...

Page 88: ...io Frequency RMII Reduced Media Independent Interface RTC Real Time Clock SAW Surface Acoustic Wave SDIO Secure Digital Input Output SIM Subscriber Identification Module SMS Short Message Service SMTP Simple Mail Transfer Protocol SPI Serial Peripheral Interface SRF Self Resonant Frequency SSL Secure Socket Layer TBD To Be Defined TCP Transmission Control Protocol TDD Time Division Duplex TIS Tota...

Page 89: ...ry equipment of digital cellular radio telecommunications systems 9 ETSI EN 301 489 24 V1 4 1 Electromagnetic compatibility and Radio spectrum Matters ERM ElectroMagnetic Compatibility EMC standard for radio equipment and services Part 24 Specific conditions for IMT 2000 CDMA Direct Spread UTRA for Mobile and portable UE radio and ancillary equipment 10 u blox Firmware Update Application Note Docu...

Page 90: ... Ltd Phone 65 6734 3811 E mail info_ap u blox com Support support_ap u blox com Regional Office Australia Phone 61 2 8448 2016 E mail info_anz u blox com Support support_ap u blox com Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Shenzhen Phone 86 755 8627 1083 E mail info_cn u blox com Support support_cn u blox c...

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Ublox MPCI-L1 series, System Integration Manual

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