MAX-M10M - Integration manual
Figure 28: GND stub ended with a via
It is recommended to ground the area below the module, on the top and second layer. Avoid signal
lines crossing below the module at these two layers.
For the RF signal line, it is best to use the co-planar waveguide with ground on the second layer. All
the RF parts need a solid GND plane underneath in order to achieve the targeted impedance in the
RF signal line.
The length and geometry in the RF signal line must be carefully analyzed. The impedance of the RF
signal line must be 50 Ω. Select the stack-up, copper, and dielectric properties of the PCB accordingly
to fulfill this condition. The RF signal line should be as short as possible and the ground plane around
should be filled with GND vias.
Be careful when placing the receiver in proximity to circuitry that can emit heat. Temperature-
sensitive components inside the module, like TCXOs and crystals, are sensitive to sudden changes
in ambient temperature which can adversely impact satellite signal tracking. Sources can include
co-located power devices, cooling fans or thermal conduction via the PCB.
The GND planes can conduct heat to other elements, but they can act as heat dissipators as well.
Increasing the number of GND vias helps to decrease sudden temperature changes.
High temperature drift and air vents can affect the GNSS performance. For best performance,
avoid high temperature drift and air vents near the module.
4.4.1 Package footprint, copper and solder mask
shows the dimensions of the MAX-M10M form factor.
UBX-22038241 - R02
4 Hardware integration
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