LISA-U2 series - System integration manual
UBX-13001118 - R27
Handling and soldering
Page 159 of 183
C1-Public
4
Handling and soldering
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No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
4.1
Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, Moisture Sensitivity levels (MSD), shipment and
storage information, as well as drying for preconditioning see the LISA-U2 series data sheet
the u-blox package information user guide
The LISA-U2 modules are Electrostatic Discharge (ESD) sensitive devices.
⚠
Ensure ESD precautions are implemented during handling of the module.
4.2
Soldering
4.2.1
Soldering paste
The use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after
the soldering process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste:
OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification:
95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)
95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)
Melting Temperature: +217 °C
Stencil Thickness:
150 µm for base boards
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations in section
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The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
4.2.2
Reflow soldering
A convection type soldering oven is strongly recommended
over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature and all parts will be heated up
evenly, regardless of material properties, thickness of components and surface color.
Consider the “IPC
-7530A Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”.
Reflow profiles are to be selected according to the following recommendations.
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Failure to observe these recommendations can result in severe damage to the device!
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Be aware that IPC/JEDEC J-STD-020 applies to integrated circuits, and cannot be properly applied
to module devices.
