NEO-5
-
Hardware
Integration
Manual
Preliminary
Design-In
GPS.G5-MS5-08003-A2
u-blox
proprietary
Page 20
your position is our focus
Solder
Mask
Copper
Mask
Paste
Mask
Module
1.0
mm
[39.3
mil]
0.8
mm[31.5
mil]
0.8
mm
[31.5
mil]
3.0
mm
[118.1
mil]
1.1
mm
[43.3
mil]
minimal
distance
Next
Component
Step
Stencil
0.
8m
m
[31.
5m
il]
1.5mm [58.9mil]
0.
65
m
m
[
25
.5m
il]
0.
8m
m
[31.
5
m
il]
0.1mm
[3.9mil]
0.65mm
[25.5mil]
1.7mm [66.8mil]
Figure 9: Recommendations for copper, solder and paste masks with enlargement
The
paste
mask
outline
needs
to
be
considered
when
defining
the
minimal
distance
to
the
next
component.
These
are
recommendations
only
and
not
specifications.
The
exact
geometry,
distances,
stencil
thicknesses,
step
heights
and
solder
paste
volumes
must
be
adapted
to
the
specific
production
processes
(e.g.
soldering
etc.)
of
the
customer.
2.7.3 Placement
A
very
important
factor
in
achieving
maximum
GPS
and
GALILEO
performance
is
the
placement
of
the
receiver
on
the
PCB.
The
connection
to
the
antenna
must
be
as
short
as
possible
to
avoid
jamming
into
the
very
sensitive
RF
section.
Make
sure
that
RF
critical
circuits
are
clearly
separated
from
any
other
digital
circuits
on
the
system
board.
To
achieve
this,
position
the
receiver
digital
part
towards
your
digital
section
of
the
system
PCB.
Care
must
also
be
exercised
with
placing
the
receiver
in
proximity
to
circuitry
that
can
emit
heat.
The
RF
part
of
the
receiver
is
very
sensitive
to
temperature
and
sudden
changes
can
have
an
adverse
impact
on
performance.
The RF part of the receiver is a temperature sensitive component. Avoid high temperature
drift and air vents near the receiver.
