NINA-B1 series - System Integration Manual
UBX-15026175 - R06
Handling and soldering
Page 39 of 48
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Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the
two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the
sticker and the ink-jet printed text.
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Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators.
For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering process.
4.3.3
Other remarks
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Only a single reflow soldering process is allowed for boards with a module populated on it.
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Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices may require wave soldering to solder the THT components. Only a single wave soldering
process is allowed for boards populated with the modules.
Miniature Wave Selective Solder
process is
preferred over traditional wave soldering process.
•
Hand soldering is not recommended.
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Rework is not recommended.
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Conformal coating may affect the performance of the module, it is important to prevent the liquid from
flowing into the module. The RF shields do not provide protection for the module from coating liquids
with low viscosity, therefore care is required in applying the coating. Conformal coating of the module
will void the warranty.
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Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or other
forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void
module’s warranty. The numerous ground pins are adequate to provide optimal immunity to
interferences.
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The module contains components that are sensitive to Ultrasonic Waves. Use of any ultrasonic processes
such as cleaning, welding etc., may damage the module. Use of ultrasonic processes on an end product
integrating this module will void the warranty.
