TYWRD1S Datasheet
Hangzhou Tuya Information
Technology Co., Ltd.
17
V3.0.0
ii.
Anti-static heat-resistant trays
iii.
Anti-static heat-resistant gloves
2.
Storage conditions for a delivered module are as follows:
(1)
The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
(2)
The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3)
The package contains a humidity indicator card (HIC).
Figure 6-5 HIC for TYWRD1S
3.
Bake a module based on HIC status as follows when you unpack the module
package:
(1)
If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2)
If the 30% circle is pink, bake the module for 4 consecutive hours.
(3)
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4)
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4.
Baking settings:
(1)
Baking temperature: 125±5°C
(2)
Alarm temperature: 130°C
(3)
SMT placement ready temperature after natural cooling: < 36°C
(4)
Number of drying times: 1
(5)
Rebaking condition: The module is not soldered within 12 hours after baking.