Preliminary Preliminary User's Manual l TQMaX4XxL UM 0001 l © 2022, TQ-Systems GmbH
Page 31
5.5
Structural requirements
The TQMaX4XxL has to be soldered on the carrier board. The TQMaX4XxL is held on the mainboard by the holding force of the
solder connections from the LGA pads and requires no further fastening measures. If there are high requirements for vibration
and shock resistance, a module holder must be provided in the final application to additionally hold the module in position.
Since no heavy and large components are used, there are no further requirements.
Attention: Note on equipping the base board
To ensure a high-quality connection of the LGA pads when reflow soldering the TQMaX4XxL, the LGA
pads must be free of grease and contamination. Please contact
for soldering instructions
