Preliminary User's Manual l TQMaX4XxL UM 0001 l © 2022, TQ-Systems GmbH
Page 30
5.2
TQMaX4XxL component placement
Figure 21:
TQMaX4XxL component placement top
Figure 22:
TQMaX4XxL component placement bottom
The labels on the TQMaX4XxL show the following information: TBD
Table 15:
TBD Labels on TQMaX4XxL
Label
Text
AK1
TQMaX4XxL 2D serial number
AK2
TQMaX4XxL MAC address
AK3
TQMaX4XxL version and revision
5.3
Protection against external effects
As an embedded module the TQMaX4XxL is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
5.4
Thermal management
The power dissipation mainly depends on the software used and can vary according to the application. The power dissipation
mainly arises at the processor, the switching regulators and the LPDDR4 devices. It is the customer’s responsibility to define a
suitable cooling method for his use case.
Attention: Destruction or malfunction, TQMaX4XxL cooling
The AM64x/243x belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the AM64x/243x must be taken into consideration
when connecting the heat sink, see (5). The AM64x/243x is not necessarily the highest component.
Inadequate cooling connections can lead to overheating of the TQMaX4XxL and thus malfunction,
deterioration or destruction.
AK3
AK1
AK2
