User's Manual l TQMa8MxML UM 0103 l © 2022, TQ-Systems GmbH
Page 55
8.
APPENDIX
8.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 46:
Acronyms
Acronym
Meaning
ARM
®
Advanced RISC Machine
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSP
Board Support Package
CPU
Central Processing Unit
CSI
CMOS Sensor Interface
DDR
Double Data Rate
DIN
Deutsche Industrie Norm (German industry standard)
DNC
Do Not Connect
DSI
Display Serial Interface
ECSPI
Enhanced Configurable SPI
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic Compatibility
eMMC
embedded Multimedia Card (Flash)
EN
Europäische Norm (European standard)
ESD
Electrostatic Discharge
EuP
Energy using Products
FR-4
Flame Retardant 4
Gbps
Gigabit per second
GPIO
General Purpose Input/Output
HS
High-Speed
I/O
Input/Output
I
2
C
Inter-Integrated Circuit
I
2
S
Integrated Interchip Sound
IP00
Ingress Protection 00
JEDEC
Joint Electronic Device Engineering Council
JTAG
®
Joint Test Action Group
LGA
Land Grid Array
LPDDR4
Low Power DDR4
MAC
Media Access Control
MIPI
Mobile Industry Processor Interface
MTBF
Mean operating Time Between Failures
NAND
Not-And
NC
Not Connected
NOR
Not-Or
NP
Not Placed
OTG
On-The-Go
