User's Manual l TQMa8MxML UM 0103 l © 2022, TQ-Systems GmbH
Page 51
5.3
Adaptation to the environment
The TQMa8MxML has overall dimensions (length × width) of 38 × 38 mm².
The TQMa8MxML has a maximum height above the carrier board of approximately 3.0 mm.
The TQMa8MxML has 281 LGA pads with a diameter of 1.0 mm and a grid of 1.9 mm.
The TQMa8MxML weighs approximately 10 grams.
5.4
Protection against external effects
As an embedded module, the TQMa8MxML is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
5.5
Thermal management
To cool the TQMa8MxML, approximately 4 watts (TQMa8MxML) or 3 watts (TQMa8MxNL) have to be dissipated, see Table 37.
The power dissipation originates primarily in the i.MX 8M Mini/Nano, the LPDDR4 SDRAM and the PMIC.
The power dissipation also depends on the software used and can vary according to the application.
See NXP documents (6) and (10) for further information.
Attention: Destruction or malfunction, TQMa8MxML cooling
The i.MX 8M Mini belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA pads, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the i.MX 8M Mini must be taken into consideration
when connecting the heat sink, see (10). The i.MX 8M Mini is not necessarily the highest component.
Inadequate cooling connections can lead to overheating of the TQMa8MxML and thus malfunction,
deterioration or destruction.
5.6
Structural requirements
The TQMa8MxML has to be soldered on the carrier board. To ensure a high-quality connection of the LGA pads during reflow
soldering of the TQMa8MxML, the LGA pads must be free of grease and dirt.
Please contact
for soldering instructions (14).
