User's Manual l MBa8Xx UM 0100 l © 2020, TQ-Systems GmbH
Page 49
5.2
Notes of treatment
The TQMa8Xx is held in the mating connectors with a retention force of approximately 28 N.
To avoid damaging the TQMa8Xx connectors as well as the carrier board connectors while removing the TQMa8Xx
the use of the extraction tool MOZI8XX is strongly recommended.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the MBa8Xx
for the extraction tool MOZI8XX.
5.3
Embedding in the target system
The MBa8Xx serves as a design base for customer products, as well as a reference platform during development.
5.4
Housing
The form factor and the mounting holes of the MBa8Xx are designed for installation in a standard EURO housing.
5.5
Thermal management
The greatest power dissipation on the MBa8Xx is caused by the voltage regulators. In addition, the TQMa8Xx is a heat source that
acts indirectly on the MBa8Xx. Depending on the application, further power dissipation can occur, mainly at additional external
loads on the pin headers on the MBa8Xx, the Mini PCIe slot, etc.
For evaluation of the TQMa8Xx under high load conditions an optional heat sink or heat spreader is provided. Three holes are
provided on the MBa8Xx for this purpose. The metallization of the mounting hole has GND potential.
