Preliminary User's Manual l MBLS1012AL UM 0001 l © 2019, TQ-Systems GmbH
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6.3
Thermal management
No special precautions were taken concerning the thermal management of the TQMLS1012AL.
The power dissipation also depends on the software used and can vary according to the application.
The power dissipation originates primarily in the CPU, the DDR3L SDRAM and the PMIC.
More information is to be taken from the TQMLS1012AL Preliminary User's Manual.
Attention: Destruction or malfunction
The MBLS1012AL belongs to a performance category in which a cooling system is essential in most
applications. It is the user’s sole responsibility to define a suitable heat sink (weight and mounting
position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack
height, airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA
balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the TQMLS1012AL
must be taken into consideration when connecting the heat sink.
The TQMLS1012AL is not the highest component. Inadequate cooling connections can lead to
overheating of the MBLS1012AL and thus malfunction, deterioration or destruction.
6.4
Assembly
Illustration 33:
MBLS1012AL component placement top
Illustration 34:
MBLS1012AL component placement bottom
