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Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
④
Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N
•
m
⑤
Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N
•
m
④
Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N
•
m
⑤
Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N
•
m
①
Card spacer
②
Single-touch spacer
③
Screw (M4x14)
①
Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
②
Single-touch spacer
③
Screw
(M4x14)
First remove the
screws
③
, and then
remove the P.C.
board assembly.
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM , IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM , IGBT and rectifier devices.
Comp-IPDU P.C.board
(43H69013)
P.C.board
⑥
Screw (M3x20)
Used to secure the IGBT and rectifiers
Screw tightening torque: 0.55 ±0.1 N
•
m