RES-32DCX Installation Manual
xxiv
Themis Computer
The 3RU-high (5.25”) RES-32DCX has been designed to fit into a standard 19” rack
and is provided with rack-mount brackets without handles.
Optional
rack-mount
brackets with handles and
optional
rack-mount slides are also available. The RES-
32DCX is rugged enough to withstand extreme shock (up to 25G), temperature (up
to 50°C), and EMI such as that associated with such demanding markets as the mili-
tary, aerospace, and telecommunications industries.
The two dual-core Intel Xeon CPUs operate up to 2.33 GHz (with a 1333-MHz
front-side system bus) and support up to 32 GigaBytes of DDR2 ECC FB-DIMM
memory modules. The RES-32DCX is based on the functionality and capability of
the Intel 5000X (Greencreek) chipset, which consists of the following three devices:
• Intel 5000X Memory Controller Hub (MCH)
• Intel 6700PXH 64-bit PCI-X Hub (PXH-V)
• Intel 6321 ESB2 (Enterprise South Bridge 2) I/O Controller Hub (ICH)
An overview of RES-32DCX design and specifications is given in Chapter 1, "Over-
view and Specifications", of this manual.
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Summary of Contents for RES-32DCX
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