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TRF370x Quadrature Modulator Evaluation
Module

User's Guide

Literature Number: SLWU062

March 2010

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Summary of Contents for TRF370 Series

Page 1: ...TRF370x Quadrature Modulator Evaluation Module User s Guide Literature Number SLWU062 March 2010...

Page 2: ...2 SLWU062 March 2010 Submit Documentation Feedback Copyright 2010 Texas Instruments Incorporated...

Page 3: ...0x EVM Operating Procedure 6 2 Physical Description 11 2 1 PCB Layout 11 2 2 Parts List 16 3 Circuit Description 16 3 1 Circuit Function 16 4 Circuit Board 17 5 Schematic 18 3 SLWU062 March 2010 Table...

Page 4: ...19 2 mA Full Scale 10 6 Top Layer 1 11 7 Top Layer 2 12 8 Ground Plane 1 12 9 Ground Plane 2 13 10 Bottom Layer 1 13 11 Bottom Layer 2 14 12 Drill Pattern 15 13 Silkscreen Top Layer 17 14 TRF370x EVM...

Page 5: ...M comes configured for differential I Q input signals via four SMA connectors as shown in the schematic Figure 14 and in Table 1 For the upper sideband the I signals are connected to J4 I and J3 I The...

Page 6: ...litude and phase of the CW signal coming from the arbitrary waveform generator 6 Connect a spectrum analyzer to the SMA connector marked RFOUT J7 and monitor the TRF370x output 1 4 1 Typical Test Resu...

Page 7: ...n be adjusted to achieve suppression levels that exceed 60 dBc The level of suppression observed depends on the amount of resolution available from the source driving the modulator By using TI s DAC56...

Page 8: ...you obtain the minimum carrier feedthrough A typical carrier feedthrough value exceeds 50 dBm See Figure 2 1 4 1 4 GSM EDGE EVM Measurements 1 Provide a GSM edge signal of the desired frequency into...

Page 9: ...5 shows an example of interfacing the DAC568x to the TRF370333 with options for selecting the desired amount of attenuation between the two Additional interfacing networks for each modulator can be fo...

Page 10: ...ator is available SLWC083 Figure 4 1 5 V Interface Network for 19 2 mA Full Scale LOSS 1 dB 2 dB 3 dB 4 dB 5 dB Pullup R1 115 115 115 115 115 Pulldown R3 634 634 634 634 634 Series R5 11 21 30 37 4 45...

Page 11: ...d on the evaluation module 2 1 PCB Layout The EVM is constructed on a four layer 38 1 mm 38 1 mm 1 579 mm thick PCB using FR 4 material Figure 6 through Figure 12 show the individual layers Figure 6 T...

Page 12: ...al Description www ti com Figure 7 Top Layer 2 Figure 8 Ground Plane 1 12 TRF370x Quadrature Modulator Evaluation Module SLWU062 March 2010 Submit Documentation Feedback Copyright 2010 Texas Instrumen...

Page 13: ...om Physical Description Figure 9 Ground Plane 2 Figure 10 Bottom Layer 1 13 SLWU062 March 2010 TRF370x Quadrature Modulator Evaluation Module Submit Documentation Feedback Copyright 2010 Texas Instrum...

Page 14: ...6 Physical Description www ti com Figure 11 Bottom Layer 2 14 TRF370x Quadrature Modulator Evaluation Module SLWU062 March 2010 Submit Documentation Feedback Copyright 2010 Texas Instruments Incorpora...

Page 15: ...1 www ti com Physical Description Figure 12 Drill Pattern 15 SLWU062 March 2010 TRF370x Quadrature Modulator Evaluation Module Submit Documentation Feedback Copyright 2010 Texas Instruments Incorporat...

Page 16: ...For TRF370315 QFN_24_163x163_ TRF370315 TI TRF370315 EVM TI 0p50mm supplied For TRF370417 QFN_24_163x163_ TRF370417 TI TRF370417 EVM TI 0p50mm supplied 11 2 TP1 TP3 BLK TP_THVT_100_RND KEYSTONE 5001K...

Page 17: ...Connection Description TP4 5 V VCC U1 analog supply TP2 5 V VCC U1 analog supply TP3 TP1 Analog ground 4 Circuit Board This chapter shows the circuit board test points Figure 13 Silkscreen Top Layer 1...

Page 18: ...NI J5 QN 1 2 3 4 5 J7 RF_OUT 1 2 3 4 5 C9 1uF DNI C8 1uF DNI C1 100pF C7 RED BLK 4 7uF J2 LON 1 2 3 4 5 J4 BBIP J4 BBIP 1 2 3 4 5 J6 QP J6 QP 1 2 3 4 5 C2 100pF R1 0 0 DNI C11 1uF DNI R5 0 C4 1000pF S...

Page 19: ...mperatures and voltages For additional information on TI s environmental and or safety programs please contact the TI application engineer or visit www ti com esh No license is granted under any paten...

Page 20: ...h statements TI products are not authorized for use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury...

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