Texas Instruments TPS62730, User Manual

Page: 7 / 13

G001
www.ti.com
Oscilloscope Traces
5.3 Bill of Materials
Table 2. HPA726A Bill of Materials
Count RefDes Value Description Size Part Number MFR
-001
2 C1, C2 2.2 µ F Capacitor, ceramic, 6.3-V, X5R, 20% 0402 GRM155R60J225ME15D muRata
1 C3 22 µ F Capacitor, ceramic, 16-V, X5R, 10% 0603 ECJ-1VB1A225K Panasonic
0 C4 Capacitor, ceramic, 6.3-V, X5R, 20% 0603 Std Std
7 J1, J2, J3, J4, PEC02SAAN Header, male 2-pin, 100-mil (2,54-mm) spacing 0.100 inch (2,54-mm) × 2 PEC02SAAN Sullins
J5, J6, J7
1 JP1 PEC03SAAN Header, 3-pin, 100-mil (2,54-mm) spacing 0.100 inch (2,54-mm) × 3 PEC02SAAN Sullins
1 L1 2.2 µ H Inductor, SMT, 0.8-A, 0.23- Ω 0805 LQM21PN2R2NGC muRata
1 R1 10.0 k
Ω
Resistor, chip, 1/16W, 1% 0603 Std Std
1 R2 1.00 M Ω Resistor, chip, 1/16W, 1% 0603 Std Std
1 U1 TPS62730DRY IC, step-down converter with bypass mode for low-power wireless 1,5 mm × 1 mm TPS62730DRY TI
1 – PCB, 1.7 in. × 1.5 in. x 0.031 in. (4,32 cm × 3,81 cm × 0,787 mm) HPA726 Any
1 Apply on: Shunt, 100-mil (2,54-mm), black 0.1 in (2,54-mm) 929950-00 3M
JP1-ON
6 Oscilloscope Traces
Figure 6. CH1: Phase; CH2: Output Ripple, Vin = 3.3 V, and 21- Ω Load
7 SLVU455 – April 2011 TPS62730 Stepdown Converter With Bypass Mode for Ultralow-Power Wireless
Applications
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated