Board Layout, Schematic, and Bill of Materials
5.2
Schematic and Bill of Materials
Figure 3. TPS22924EVM-532 Schematic
Table 2. Bill of Materials
(1) (2) (3) (4)
-100
-002
RefDes
Value
Description
Size
Part Number
MFR
Coun
Coun
t
t
1
1
--
PCB
0.9 In x 1.7 In x
HPA532
Any
0.062 In
1
1
C3
0.1uF
Capacitor, Ceramic, 0.1uF, 16-V, X7R
603
Std
Any
1
1
C2
1uF
Capacitor, Ceramic, 10uF, 25-V, X5R
603
Std
Any
0
0
C1, C4
OPEN
Capacitor, Ceramic
603
Std
Any
1
1
R1
36
Resistor, 5% 1/8W
805
Std
Any
1
1
R2
11
Resistor, 5% 1/8W
805
Std
Any
0
0
R3
OPEN
Resistor, 5% 1/8W
805
Std
Any
13
13
J1-J6,
PEC02SAAN
Header, 2pin, 100mil spacing
0.100 inch x 2
PTC36SAAN
Sullins
JP1-2,
JP4-8
1
1
JP3
PEC03SAAN
Header, 3pin, 100mil spacing
0.100 inch x 3
PTC36SAAN
Sullins
1
0
U1
TPS22924BYZ
IC, Single Chip, Low Input Voltage Current-Limited Load
YZ
TPS22924BYZ
TI
Switch with Shut Off Auto-Restart
0
1
U1
TPS22924CYZP
IC, Single Chip, Low Input Voltage Current-Limited Load
YZP
TPS22924CYZP
TI
Switch with Shut Off Auto-Restart
1
1
1.25 x 0.25
THT-13-457-10
Brady
Label, see
(5)
inch
3
3
NA
Shunt, 100-mil, Black
0.100
929950-00
3M
(1)
These assemblies are ESD sensitive, ESD precautions shall be observed.
(2)
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
(3)
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
(4)
Ref designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent components.
(5)
Install label in silkscreened box after final wash. Text shall be 8 point font. Text shall be per
Table 3.
Assembly Number
Text
HPA532-001
TPS22924BEVM-001
HPA532-002
TPS22924CEVM-002
4
TPS22924EVM-532
SLVU456A
–
May 2011
–
Revised June 2011
Copyright
©
2011, Texas Instruments Incorporated