Board Layout, Bill of Materials, and Schematic
15
SLOU439 – March 2016
Copyright © 2016, Texas Instruments Incorporated
TAS5733L Evaluation Module
The bottom layer of the board is designed to have a clear path that is used as a heat escape from the
device. RC-snubber circuits are not generally required in properly-designed 2-layer or 4-layer designs.
However, in systems where capacitors for PVDD or LC filter placement is compromised, the snubber
circuit is used to slow down the output square waves coming from the IC speaker outputs. A snubber
circuit for each output is featured in the evaluation module to showcase their recommended position, if
required for an end-system. The circuits are positioned so the thermal flow of the device has a radial clear
path out of the board.
Figure 11. Bottom Layer Thermal Flow
By default, the output filter of the stereo device is configured in BD mode. The user is able to evaluate the
devices in AD mode by populating the optional AD capacitors (C24, C27, and C51) in the evaluation
module. The I²C address of the devices can be changed as well, if required. By default, the stereo device
has an address of 0x56 and the mono device address is 0x54. Resistors R13, R14, R15, and R16
determine the address of each amplifier. Refer to the
of the evaluation module for more
information.
Figure 12. TAS5733LEVM Optional Features
The evaluation module is a four-layer board designed to enhance the thermal performance and
robustness of the design. The second layer is used as ground plane, while the third layer contains the
power planes that distribute the supply voltages through the board.
TI recommends following the layout of this EVM as close as possible to get the same performance
obtained during the evaluation of the device. Any design variation can be supported by TI through
schematic and layout review, as in the case of a different layer number, filter option, and component
location, or if performance issues are present in the end-design. Join the
audio amplifier discussion forum
at
for additional design assistance.