Hardware Description
18
SWRU372C – June 2014 – Revised March 2020
Copyright © 2014–2020, Texas Instruments Incorporated
CC3200 SimpleLink™ Wi-Fi
®
and Internet of Things Solution With MCU
LaunchPad™ Hardware
2.8
Design Files
2.8.1
Hardware
All design files include schematics, layout, Bill of Materials (BOM), Gerber files, and documentation, which
are made available for download from the following URL:
http://www.ti.com/tool/cc3200-launchxl-rd
.
2.8.2
Revision History
Table 10. Change Log
PCB Revision
Description
Rev 3.0B
• First baseline revision
Rev 3.1
The main changes pertain to the bill of materials (BOM) and the layout:
• Replaced the caps C23, C24 with ceramic ones to minimize leakage current
• R62 is made to DNP by default so that the jumper is used to measure the hibernate current
• Miscellaneous silk screen changes to clearly annotate components on the board.
Rev 3.2
• Layout changes for the DC-DC section to improve the mask margin
• Updated the silk screen to reflect the final markings.
Rev 4.1
• Added pullup and pulldowns for the serial flash. (Reduces hibernate current to around 17 uA)
• Moved the nRESET pull from VCC_BRD to VBAT_CC (ensures always pulled high).
• Added pullup on UART_TX going to the FTDI to prevent false start bits.
• Added pullup resistor for acccelerometer address to avoid conflict with audio booster pack
• Added 100K pullup on RESET_OUT net for any BP without RESET pulls.
• Changed R61 to 2.7K, R57-> 270
Ω
(To solve false entering to bootloader mode)
• Miscellaneous silk changes
2.8.3
Software
All design files including firmware patches, software example projects, and documentation are made
available from the
SimpleLink Wi-Fi Platform page
.
The software development kit (SDK) for the CC3200 LaunchPad kit can be obtained from
http://www.ti.com/tool/cc3200sdk
.
