Table B-16. MSP-TS430RSB40 Bill of Materials
Pos.
Ref Des
No. Per Board
Description
Digi-Key Part No.
Comment
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
2
C3, C7, C10,
C12
3
10uF, 10V, SMD 0805
445-1371-1-ND
DNP C12
3
C4, C6, C8,
C11
3
100nF, SMD0805
311-1245-2-ND
DNP C11
4
C5
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
4
10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
7.1
4
10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
8
JP1, JP4,JP5,
JP6, JP7, JP8,
JP9, J5, JP10
9
3-pin header, male, TH
SAM1035-03-ND
Jumper: 1-2 on JP1, JP10; 2-3
on JP4-JP9
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
DNP. Keep vias free of solder
12
U1
1
QFN-40B-0.4_
ENPLAS_SOCKET
Enplas
13
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free of
solder
15
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
16
R1,R7
2
330R SMD0805
17
R2, R3, R5,
R6, R8, R9,
R10
3
0R SMD0805
DNP R2, R3, R5, R6
18
R4
1
47k SMD0805
19
MSP430
2
MSP430F5132
DNP: enclosed with kit. Is
supplied by TI
20
Rubber stand
off
4
select appropriate; for example,
Buerklin: 20H1724
apply to corners at bottom side
Hardware
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
MSP430™ Hardware Tools
77
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