www.ti.com
400mil
47.5mil
2700mil
3250mil
1300mil
1700mil
1247.5mil
1247.5mil
Notes:
1.
PWB to be fabricated to meet or exceed IPC-6012
Class 3 standards and workmanship shall conform
to IPC-A-600, Class 3 - current revisions.
2.
Board material and construction to be UL-Approved
and marked on the finished board.
3.
Laminate material: Copper-Clad FR-4.
4.
Copper weight: 1 oz. finished, all layers.
5.
Finished thickness: .062 ±.010.
6.
Min plating thickness in through holes: .001in.
7.
SMOBC / HASL.
8.
LPI soldermask both sides using appropriate
layer artwork, color = green.
9.
LPI silkscreen as required: color = white.
10. Vendor information to be incorporated on back side
whenever possible.
11. Minimum copper conductor width is: 7 mils.
Minimum conductor spacing is: 7 mils.
12. Number of finished layers: 4.
13. Board dimensions: 3.250 in x 1.7 in.
50
15mil
0.381 mm
PTH
43
23.622mil 0.6mm
PTH
42
39.37mil
1mm
PTH
5
40mil
1.016mm
PTH
6
47.244mil 1.2mm
PTH
1
63mil
1.6002mm
PTH
147 total
2.2
EVM Performance
PCB Design and Performance
Figure 8. DAC8554EVM—Drill Drawing
The EVM performance test is executed using a high-density DAC bench test board, an Agilent 3458A
digital multimeter and a PC running LabVIEW™ software. The EVM board is tested for linearity for all
codes between 485 and 64741. The DUT is then allowed to settle for 1ms before the meter is read. This
process is repeated for all codes to generate the measurements for INL and DNL.
Results of the DAC8554EVM tests are shown in
through
.
DAC8554EVM User's Guide
8
SBAU121 – January 2006