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SWRU331-013

Chapter 3

SWRU331A – November 2012 – Revised August 2014

Application Development

TI supports the CC3000 BoosterPack paired with the TI MSP-EXP430G2 Launchpad, a microcontroller
(MCU) test platform.

The CC3000 BoosterPack lets users easily develop a complete Wi-Fi solution paired with the MSP-
EXP430G2 Launchpad platform.

For example applications, see the

CC3000 wiki

The CC3000 BoosterPack also can be used on other platforms with the same connector interface. The TI
wiki also has a host driver porting guide to assist with porting to other platforms.

Figure 3-1

shows the Launchpad MSP-EXP430G2 test platform and the CC3000 BoosterPack EVM

board.

Figure 3-1. MSP-EXP430G2 Test Platform and CC3000 BoosterPack EVM Board

To order the MSP-EXP430G2 test platform, see the

MSP430 LaunchPad Value Line Development Kit

Application Development

SWRU331A – November 2012 – Revised August 2014

Submit Documentation Feedback

Summary of Contents for CC3000

Page 1: ...TI CC3000 BoosterPack Evaluation Module Board User s Guide Literature Number SWRU331A November 2012 Revised August 2014 ...

Page 2: ... 9 2 3 Antenna 10 2 4 Hardware Setup 13 2 5 CC3000 BoosterPack Schematic 14 2 6 Bill of Materials BOM 15 2 6 1 PCB Design Guidelines 15 2 6 2 RF Trace 15 2 6 3 Antenna 16 2 6 4 Power Trace 17 2 6 5 Ground 17 3 Application Development 18 2 Contents SWRU331A November 2012 Revised August 2014 Submit Documentation Feedback Copyright 2012 2014 Texas Instruments Incorporated ...

Page 3: ...the CC3000 BoosterPack EVM Board 17 3 1 MSP EXP430G2 Test Platform and CC3000 BoosterPack EVM Board 18 List of Tables 2 1 Key Parts of CC3000 BoosterPack EVM Board Top View 7 2 2 J2 Configuration of the CC3000 EVM Board 8 2 3 Header J11 of the CC3000 BoosterPack EVM Board Top View 8 2 4 Header J12 of the CC3000 BoosterPack EVM Board Top View 8 2 5 Header J9 of the CC3000 BoosterPack EVM Board Bott...

Page 4: ...s equipment is intended for use in a laboratory test environment only It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules which are designed to provide reasonable protection against radio frequency interference Operation of this equipment in other environments may cause in...

Page 5: ... 2 8 Changed typo in Table 2 6 name for pin 7 changed from WL_SPI_CLK pin type changed from input and description changed from clock input 10 Changed wiki title in Chapter 3 18 Changed link name in Chapter 3 18 NOTE Page numbers for previous revisions may differ from page numbers in the current version 5 SWRU331A November 2012 Revised August 2014 Revision History Submit Documentation Feedback Copy...

Page 6: ...contained Wi Fi solution that enables Internet connectivity for a wide variety of embedded applications This document details the key parts and features of the CC3000 BoosterPack EVM board along with the different options available for the user and includes layout guidelines to assist in PCB development 6 Introduction SWRU331A November 2012 Revised August 2014 Submit Documentation Feedback Copyrig...

Page 7: ...r used for conductive power tests J2 Used to swap between test mode and operation mode When pins 2 and 3 are shorted J2 runs in operation mode When pins 1 and 2 are shorted J2 runs in test mode J11 Through hole test points for more information see Table 2 3 J12 Through hole test points for more information see Table 2 4 J13 Used to switch between external power and power from the motherboard Can b...

Page 8: ...erial interface in test mode Leave floating in functional mode 4 WL_RS232_RX Input RS232 receive output used for radio tool serial interface in test mode Leave floating in functional mode Table 2 4 describes the signals on J12 Table 2 4 Header J12 of the CC3000 BoosterPack EVM Board Top View Pin Pin Name Pin Type Descriptions 1 GND Ground 2 SCL_CC3000 Output I2 C clock signal output from the CC300...

Page 9: ...e Pin Type Descriptions 1 VBAT_IN Power In Battery voltage input to module For the MSP430 host platform VIO_HOST VBAT_IN For other platforms that have different voltage levels from the battery voltages R14 can be removed 2 VBAT_SW_EN Input Active high enables signal from the host device 3 Reserved Reserved 4 Reserved Reserved 5 Reserved Reserved 6 Reserved Reserved 7 WL_SPI_CLK Input Host interfac...

Page 10: ...ut Host interface SPI data output 8 Reserved Reserved 9 Reserved Reserved 10 Reserved Reserved 2 3 Antenna The ACX ceramic mounts on the BoosterPack EVM board with a specific layout and matching circuit for the radiation tests conducted in FCC CE and IC certifications Figure 2 3 shows the location of the ACX ceramic antenna on the BoosterPack EVM board and the RF trace routing from the CC3000 modu...

Page 11: ...uit Between the Antenna and the CC3000 BoosterPack EVM Board The return loss is based on the matching circuit and RF trace routing as shown in Figure 2 5 Figure 2 5 Return Loss From the ACX Antenna and Matching Circuit 11 SWRU331A November 2012 Revised August 2014 CC3000 BoosterPack EVM Board Submit Documentation Feedback Copyright 2012 2014 Texas Instruments Incorporated ...

Page 12: ...ure 2 6 shows the antenna radiation pattern Figure 2 6 Antenna Radiation Pattern 12 CC3000 BoosterPack EVM Board SWRU331A November 2012 Revised August 2014 Submit Documentation Feedback Copyright 2012 2014 Texas Instruments Incorporated ...

Page 13: ...onnector Arrangement Table 2 7 compares the pins of the LaunchPad MSP EXP430G2 board with the CC3000 BoosterPack EVM board Table 2 7 LaunchPad to BoosterPack Pin Comparison Pin MSP430 Port CC3000 BoosterPack 1 VCC VBAT_IN 2 P1 0 VBAT_SW_EN 3 P1 1 TX NC 4 1 2 RX NC 5 P1 3 NC 6 P1 4 NC 7 P1 5 WL_SPI_CLK 8 P2 0 NC 9 P2 1 NC 10 P2 2 NC 11 P2 3 NC 12 P2 4 NC 13 P2 5 NC 14 P1 6 WL_SPI_DOUT 15 P1 7 WL_SP...

Page 14: ... ANT1 AT8010 E2R9HAA AT8010 ANT1 AT8010 E2R9HAA AT8010 1 2 R13 0R RES1005 R13 0R RES1005 U1 CC3000MOD U1 CC3000MOD RESERVED_2 4 RESERVED_1 2 WL_EN1 7 WL_EN2 5 NC 3 WL_RS232_TX 6 WL_RS232_RX 8 EXT_32K 21 GND 25 GND 9 SCL_CC3000 30 SCL_EEPROM 29 SDA_CC3000 28 SDA_EEPROM 27 GND 22 SPI_IRQ 14 SPI_DOUT 13 SPI_CS 12 SPI_CLK 17 SPI_DIN 15 VBAT_SW_EN 26 VBAT_IN 19 RF_ANT 35 GND 31 GND 33 GND 16 GND 34 VIO...

Page 15: ...data Table 2 8 PCB Stack Up Data PCB Stack Up Impedance Layer Type Thickness Single end Theory value Top side solder mask 0 50 mil Trace 20 space 5 L1 Top copper plating 1 82 mil 47 57 50 Ω 10 Prepreg 52 20 mil mil L2 copper plating 1 82 mil mil Bottom side solder mask 0 50 mil 56 84 mil TOTAL 1 44 mm 2 6 2 RF Trace Figure 2 9 shows a 50 Ω trace design recommended for the PCB layout Figure 2 9 Tra...

Page 16: ...t 1 0 5 mil W width 19 mil W1 width 1 20 mil T thickness 1 82 mil S grid separation 5 mil εr dielectric 4 3 Zo impedance 47 57 2 6 3 Antenna Figure 2 10 shows the specified guidelines for the BoosterPack antenna NOTE The antenna vendor determines the antenna guidelines Figure 2 10 Antenna Layout Guidelines 16 CC3000 BoosterPack EVM Board SWRU331A November 2012 Revised August 2014 Submit Documentat...

Page 17: ... must have a strong ground with more ground vias under the module for system stability and thermal dissipation Ground vias must be close to the pad Figure 2 12 shows the ground routing for the CC3000 BoosterPack EVM board Figure 2 12 Ground Routing for the CC3000 BoosterPack EVM Board 17 SWRU331A November 2012 Revised August 2014 CC3000 BoosterPack EVM Board Submit Documentation Feedback Copyright...

Page 18: ... BoosterPack also can be used on other platforms with the same connector interface The TI wiki also has a host driver porting guide to assist with porting to other platforms Figure 3 1 shows the Launchpad MSP EXP430G2 test platform and the CC3000 BoosterPack EVM board Figure 3 1 MSP EXP430G2 Test Platform and CC3000 BoosterPack EVM Board To order the MSP EXP430G2 test platform see the MSP430 Launc...

Page 19: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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