19 Device and Documentation Support
19.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
19.2 Documentation Support
For additional information, see the following related documents:
•
BQ76942 Technical Reference Manual
•
BQ76942 Evaluation Module User's Guide
•
Using Low-Side FETs with the BQ769x2 Battery Monitor Family
•
Cell Balancing with BQ769x2 Battery Monitors
•
Multiple FETs with the BQ769x2 Battery Monitors
•
BQ769x2 Software Development Guide
•
BQ769x2 Calibration and OTP Programming Guide
•
Pin Equivalent Diagrams for the BQ76952, BQ76942, and BQ769142
• A glossary that defines terms, acronyms, and definitions can be found at
Additional documents can be found in the product folder at
BQ76942 Technical documentation
19.2.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on
. Click on
Subscribe to updates
to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
19.3 Support Resources
are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's
19.4 Trademarks
TI E2E
™
is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
19.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
19.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
20 Mechanical, Packaging, Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
SLUSE14B – DECEMBER 2020 – REVISED DECEMBER 2021
78
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links:
Summary of Contents for BQ76942
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