Texas Instruments AN-2255, User Manual, Page: 18 / 26

LM3463 EVALUATION BOARD
W
AR
N
IN
G
:
H
IG
H
D
C
VO
L
T
AG
E
J0
J1
J
1
1
J
1
2
J
1
3
J
1
4
J
1
5
J
1
6
J2
J9 J5 J7
J4 J6 J8
J10
J3
CH0 CH1 CH2 CH3 CH4 CH5 VRAIL
GND
LM3463 EVALUATION BOARD
W
AR
N
IN
G
:
H
IG
H
D
C
VO
L
T
AG
E
J0
J1
J
1
1
J
1
2
J
1
3
J
1
4
J
1
5
J
1
6
J2
J9 J5 J7
J4 J6 J8
J10
J3
CH0 CH1 CH2 CH3 CH4 CH5 VRAIL
GND
LM3463 EVALUATION BOARD
W
AR
N
IN
G
:
H
IG
H
D
C
VO
L
T
AG
E
J0
J1
J
1
1
J
1
2
J
1
3
J
1
4
J
1
5
J
1
6
J2
J9 J5 J7
J4 J6 J8
J10
J3
CH0 CH1 CH2 CH3 CH4 CH5 VRAIL
GND
TP12
TP14
TP33
TP35
VFB
TP12
TP14
TP33
TP35
VFB
J4 = OPEN J7 = SHORT 2-3
J5 = OPEN J8 = OPEN
J6 = OPEN J9 = OPEN
TP22
TP3
TP22
TP3
TP22
TP3
MASTER
J4 = OPEN J7 = SHORT 2-3
J5 = OPEN J8 = OPEN
J6 = SHORT 2-3 J9 = OPEN
VLedFB = VCC
R2 = OPEN
R4 = OPEN
SLAVE 1
J4 = OPEN J7 = SHORT 2-3
J5 = OPEN J8 = OPEN
J6 = SHORT 2-3 J9 = OPEN
VLedFB = VCC
R2 = OPEN
R4 = OPEN
SLAVE 2
LED array 1 LED array 2 LED array 3 VRAIL
GND
VFB
Pr
im
a
ry
Po
w
e
r
Su
p
p
ly
TP12
TP14
TP16
LOAD
SCLK
SDAT
Interface to MCU for
dimming control
PCB Design
www.ti.com
15 PCB Design
Good heat dissipation helps optimize the performance of the LM3463. The ground plane should be used
to connect the exposed pad of the LM3463, which is internally connected to the LM3463 die substrate.
The area of the ground plane should be extended as much as possible on the same copper layer around
the LM3463. Using numerous vias beneath the exposed pad to dissipate heat of the LM3463 to another
copper layer is also a good practice.
Figure 12. A 12 channel lighting system using serial interface mode for dimming control
18 AN-2255 LM3463 Evaluation Board SNVA642 – May 2012
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated