LMZ10500
SNVS723C – OCTOBER 2011 – REVISED MARCH 2013
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Use of multiple 4.7 µF or 2.2µF output capacitors can be considered for reduced effective ESR and smaller
output voltage ripple. In addition to the main output capacitor, small 0.1µF – 0.01µF parallel capacitors can be
used to reduce high frequency noise.
PACKAGE CONSIDERATIONS
The nano module package includes an LTCC inductor on the bottom and a micro SMD die mounted on top. The
die has exposed edges and can be sensitive to ambient light. For applications with direct high intensity ambient
red, infrared, LED, or natural light it is recommended to have the device shielded from the light source to avoid
abnormal behavior.
Since the die is exposed on top of the package, care should be taken when picking and placing the module on
the board.
Use the following recommendations when utilizing machine placement:
•
Use 1.06mm (42mil) or smaller nozzle size so that the nozzle head does not touch the outer area of the
exposed die.
•
Use a soft tip pick and place head.
•
Add 0.05mm to the component thickness so that the device will be released 0.05mm (2mil) into the solder
paste without putting pressure or splashing the solder paste.
•
Slow the pick arm when picking the part from the tape and reel carrier and when depositing the IC on the
board.
•
If the machine releases the component by force, use minimum force or no more than 3 Newtons.
•
For PCBs with surface mount components on both sides, it is suggested to put the LMZ10500 on the top
side. In case the application requires bottom side placement, a reflow fixture may be required to protect the
module during the second reflow.
For manual placement:
•
Use a vacuum pick up hand tool with soft tip head.
•
If vacuum pick up tool is not available, use non-metal tweezers and hold the part by the inductor body side
terminals rather than the micro SMD die on top.
•
Use minimal force when picking and placing the module on the board.
•
In case a heat gun is required for rework, make sure that the heat source is pointing at the interface between
the inductor and the PCB. Do not apply heat gun directly on top of the component since it may affect the
solder joint between the micro SMD and the inductor. Using hot air station provides better temperature control
and better controlled air flow than a heat gun.
•
Go to the video section at
www.ti.com/product/lmz10500
for a quick video on how to solder rework the
LMZ10500.
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