TMPE633 User Manual Issue 1.0.3
Page 7 of 25
2 Technical Specification
Interface
Mechanical Interface
PCI Express Mini Card conforming to
PCI Express Mini Card Electromechanical Specification, Revision 2.0
Card Type: Full-Mini Card (50.95 x 30 mm)
Electrical Interface
PCI Express x1 Link conforming to
PCI Express Base Specification, Revision 2.0
The TMPE633 does not support the USB interface
Main On-Board Devices
User configurable
FPGA
XC6SLX25T-2 (Xilinx)
SPI-Flash
W25Q64FV (Winbond) 64 Mbit (contains TMPE633 FPGA Example) or
compatible
I/O Interface
I/O Channels
TMPE633-10R: 26 ESD-protected 5 V-tolerant TTL lines
TMPE633-11R: 13 differential EIA-422 / EIA-485 lines
TMPE633-12R: 13 differential M-LVDS lines
I/O Transceiver
TMPE633-10R: 74LVC2G241 (or compatible)
TMPE633-11R: 65HVD75D (or compatible)
TMPE633-12R: 65LVDM176D (or compatible)
I/O Connector
30 pol. Pico-Clasp latching connector
Physical Data
Power Requirements
Depends on FPGA design
With TMPE633 FPGA Example Design / without external load
+3.3Vaux:
100 mA typical
+1.5V:
250 mA typical
Temperature Range
Operating
-40°C to +85°C
Storage
-40°C to +85°C
MTBF
980.000 h
MTBF values shown are based on calculation according to MIL-HDBK-217F and
MIL-HDBK-217F Notice 2; Environment: G
B
20°C.
The MTBF calculation is based on component FIT rates provided by the component
suppliers. If FIT rates are not available, MIL-HDBK-217F and MIL-HDBK-217F Notice 2
formulas are used for FIT rate calculation.
Humidity
5 – 95 % non-condensing
Weight
6 g
Table 2-1 : Technical Specification
