TMPE633 User Manual Issue 1.0.3
Page 16 of 25
Thermal Management
4.7
Power dissipation is design dependent. Main factors are device utilization, frequency and GTP-transceiver
usage. Use the Xilinx XPower Estimator (XPE) or XPower Analyzer to determine if additional cooling
requirements as forced air cooling apply. Forced air cooling is recommended during operation.
The Spartan-6 FPGA has no heatsink mounted. If additional cooling is required, the TMPE633 can be
equipped with a heatsink, for example a Fischer Elektronik ICK S 14 x 14 x 6. Contact factory for this option.
Mounting a heatsink will violate the Mini PCIe Card component envelope. Check carefully if your system
provides enough spacing for a TMPE633 with mounted heatsink. In space constrained systems mounting a
heatsink may not be possible.
