TMPE627 User Manual Issue 1.0.2
Page 20 of 34
Thermal Management
4.11
All components used on the TMPE627 are rated for the industrial temperature range of -40°C to +85°C. The
actual temperature range the TMPE627 can be used in is highly dependent on the FPGA design, the load of
the modules I/O circuitry and the applied cooling method.
The module has several hot spots including operational amplifiers, ADC and DAC, power supplies and the
FPGA. The TMPE627 is equipped with a basic heatsink that help to evenly spread the heat and provides a
mounting base for additional cooling such as additional passive heatsinks, heat pipes or active cooling.
Mounting a heatsink will violate the Mini PCIe Card component envelope. Check carefully if your system
provides enough spacing for a TMPE627 with mounted heatsink. In space constrained systems mounting a
heatsink may not be possible. In this case forced air cooling must be applied during operation.
Use the Xilinx XPower Estimator (XPE) or the Vivado Power Report to determine whether additional cooling
requirements such as forced air cooling apply. It is also strongly recommended to use the internal
temperature monitoring of the Artix-7 and the on-board temperature sensor to monitor the temperature.
As an indication: With the example application running in a standard PC enclosure at 25°C the TMPE627
current requirement is 650 mA @ 3.3 V and 200 mA @ 1.5 V, resulting in a TMPE627 board temperature of
about 50°C and an internal temperature of the Artix-7 FPGA of about 60°C.
